Hybrid Bonding Equipment Market Trends and Growth Analysis | Valuates Reports

Hybrid Bonding Equipment Market Size

The global Hybrid Bonding Equipment market was valued at US$ 318 million in 2023 and is anticipated to reach US$ 496.5 million by 2030, witnessing a CAGR of 7.1% during the forecast period 2024-2030.

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Hybrid Bonding Equipment is a key equipment used in integrated circuit manufacturing. It is used to achieve bonding between different materials, reliably joining them together to form electronic devices.

Semiconductors are a key enabling technology for a wide range of products in nearly every sector of our economy. Following strong growth of 26.2% in 2021, the global semiconductor market will show single-digit growth in 2022, with a total size of US$580 billion and a growth rate of 4.4%. In 2022, all geographic regions except Asia Pacific will show double-digit growth. Sales in the Americas were US$142.1 billion, a year-on-year increase of 17.0%, sales in Europe were US$53.8 billion, a year-on-year increase of 12.6%, sales in Japan were US$48.1 billion, a year-on-year increase of 10.0%, while sales in the largest region, the Asia-Pacific region, were US$336.2 billion, a year-on-year decrease of 2.0%. According to the World Semiconductor Trade Statistics (WSTS), the industry experienced major ups and downs in 2022. While chip sales reached their highest annual total ever in 2022, a slowdown in the second half of the year significantly limited growth. In 2022, global semiconductor sales will reach US$574 billion, of which US semiconductor companies' sales total US$275 billion, accounting for 48% of the global market. In order to maintain industry competitiveness, U.S. semiconductor companies' investment in R&D has also reached a record high of US$58.8 billion. Historically, the PC/computer and communications end markets have accounted for approximately two-thirds of total sales, with industries such as automotive, industrial and consumer electronics accounting for the remainder. But according to WSTS's 2022 Semiconductor End-Use Survey, sales in end markets in 2022 show clear changes. Although the PC/computer and communication terminal market will still account for the largest share of semiconductor sales in 2022, its lead has narrowed. Meanwhile, automotive and industrial applications experienced the largest growth this year.

By Type
• Fully Automatic
• Semi-automatic

By Application
• 200 mm
• 300 mm

Key Companies
EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machinetool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech, Hutem, Canon, Bondtech, TAZMO, TOK

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This release was published on openPR.