Press release
Vertical MEMS Probe Cards Market Revenue, Insights, Overview, Outlook, Analysis
Vertical MEMS Probe Cards Market SizeThe global Vertical MEMS Probe Cards market was valued at US$ 1227.9 million in 2023 and is anticipated to reach US$ 2266.8 million by 2030, witnessing a CAGR of 8.8% during the forecast period 2024-2030.
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Vertical Probe Cards refers the probe cards' probe needles are vertical to the substrate. MEMS stands for "microelectromechanical system." It generally refers to high-density devices (particularly those with moving parts) that are produced by integrating machine element components, sensors, actuators, and electrical circuits on the surface of a single silicon substrate, glass substrate, or organic material through microfabrication technologies. Vertical MEMS Probe Cards are probe cards that use vertical-pin-type probe and manufacturing with MEMS technology.
Global vertical MEMS probe cards include FormFactor, Technoprobe S.p.A., Micronics Japan(MJC), Japan Electronic Materials(JEM) and MPI Corporation, etc. Global top 5 companies hold a share over 78%. North America is the largest market, with a share about 35%, followed by Europe and Japan with the share about 18% and 17%.In terms of product, pitch below 60 µm is the largest segment, with a share over 65%. And in terms of application, the largest application is memory devices, followed by microprocessors.
This report aims to provide a comprehensive presentation of the global market for Vertical MEMS Probe Cards, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Vertical MEMS Probe Cards.
The report will help the Vertical MEMS Probe Cards manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
By Type
• Pitch Below 60 μm
• Pitch 60-100 μm
• Pitch Above100 μm
By Application
• Memory Devices
• Microprocessors
• SoC Devices
Key Companies
FormFactor, Technoprobe S.p.A., Micronics Japan (MJC), Japan Electronic Materials (JEM), MPI Corporation, SV Probe, Microfriend, Korea Instrument, Will Technology, TSE, Feinmetall, TIPS Messtechnik GmbH, STAr Technologies
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