Front End of the Line Semiconductor Equipment Market Size

Front End of the Line Semiconductor Equipment Market Size

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period.

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Report Scope
The front-end-of-line (FEOL) is the first portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) are patterned in the semiconductor. FEOL generally covers everything up to (but not including) the deposition of metal interconnect layers.
The global Front End of the Line Semiconductor Equipment market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.156% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited.

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Segment by Type
• Lithography
• Coater/Developer
• Etching Equipment
• Cleaning Equipment
• CVD Equipment
• Ion Implantation Equipment
• Oxidation Furnace
• Inspection Equipment
• Others

Segment by Application
• Electronics
• Medical Devices
• Automotive
• Others

By Company

ASML, Canon, Nikon, Tokyo Electron, SCREEN, SEMES, SUSS MicroTec, Kingsemi, TAZMO, Litho Tech Japan Corporation, Lam Research, TEL, Applied Materials, Hitachi High-Technologies, Oxford Instruments, SPTS Technologies, Plasma-Therm, GigaLane, SAMCO, AMEC, NAURA, ASM International, Axcelis, ABIT, Kingstone Semiconductor, Valtech, SMEE, Centrotherm, ACM Research, Shibaura Mechatronics

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This release was published on openPR.