With 4.8% CAGR, Radiation Hardened Electronics Market Growth to Surpass USD 2.1 billion

The radiation-hardened electronics market is expected to grow from USD 1.7 billion in 2024 to USD 2.1 billion by 2029, at a CAGR of 4.8% during the forecast period. The increasing utilization of satellites for various purposes, including communication, navigation, and Earth observation, drives the demand for radiation-hardened electronics onboard these satellites.

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The market, in terms of components, is expected to be led by power management. Power management is a leading segment due to the increased demand for MOSFETs in various space and defense applications. Market players also demand new advancements in this technology. The major focus is on integrating radiation-hardened electronic power management chipsets into various devices.

The radiation-hardening by design (RHBD) market in radiation-hardened electronics is expected to grow at a higher CAGR during the forecast period. RHBD is generally more cost-effective than other radiation-hardening methods like post-processing or shielding. This is because it integrates radiation resistance into the design from the beginning, eliminating the need for additional steps and materials.
The Asia Pacific region is expected to grow at the highest CAGR during the forecast period. Several countries in the region, like China, India, and Japan, have ambitious space programs involving satellite launches, lunar exploration, and deep space missions. These programs require robust electronics capable of withstanding the harsh radiation environment of space. China and India are the major suppliers of radiation-hardened electronics in the region and are expected to increase the demand for radiation-hardened electronics in the region.

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Major companies in the radiation-hardened electronics market include Microchip Technology Inc.(US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), AMD (US), Texas Instruments (US), Honeywell International Inc. (US), Teledyne Technologies (US), TTM Technologies, Inc. (US), among others.

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