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3D IC And 2.5D IC Packaging Global Market to Reach $81.67 Bn By 2028, emerging at a CAGR of 10.7 percent and forecast 2024-2028 | Siemens AG, Ansys Inc., Synopsys Inc., UTAC Holdings Ltd., Broadcom Inc.

3D IC And 2.5D IC Packaging Global Market

3D IC And 2.5D IC Packaging Global Market

The 3d ic and 2.5d ic packaging market size has grown rapidly in recent years. It will grow from $48.6 billion in 2023 to $54.39 billion in 2024 at a compound annual growth rate (CAGR) of 11.9%. The growth in the historic period can be attributed to miniaturization of electronic devices, demand for improved power efficiency, demand for improved signal integrity, demand for consumer electronics and gaming devices, performance enhancement.

The 3d ic and 2.5d ic packaging market size is expected to see rapid growth in the next few years. It will grow to $81.67 billion in 2028 at a compound annual growth rate (CAGR) of 10.7%. The growth in the forecast period can be attributed to emergence of wearable and portable devices, growing need for energy efficiency, rising demand for high-performance computing (hpc), shift toward system-on-chip (soc) designs, increasing complexity of semiconductor devices, iot proliferation. Major trends in the forecast period include 5g technology advacements , advanced interconnect technologies, industry collaboration and standards, technological advancements in semiconductor technology, innovation in packaging materials.

Market Overview -
3D IC (integrated circuit) and 2.5D IC packaging are advanced packaging technologies used in the semiconductor industry to increase chip density and improve performance. 3D IC packaging has multiple integrated circuits which are vertically stacked, allowing for increased interconnect density and shorter interconnect lengths. 2.5D IC packaging connects multiple chips with an interposer, typically a silicon substrate.

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Surging Demand For Consumer Electronics To Drive Market Growth
The growing demand for consumer electronics is expected to propel the growth of the 3D IC and 2.5D IC packaging market going forward. Consumer electronics refers to any electronic equipment created to be bought and utilized by consumers or end users for personal, daily, and non-commercial uses. 3D IC (Integrated Circuit) and 2.5D IC packaging are advanced packaging technologies that offer enhanced performance, increased functionality, and the miniaturization of electronic devices. The growing demand for consumer electronics and gaming devices is driven by technological advancements, increasing disposable income, gaming industry expansion, digital transformation, remote work, and entertainment trends, changing lifestyles and preferences, and the influence of social media and content consumption. For instance, in January 2023, according to the annual financial report 2022 published by LG, a South Korea-based consumer electronics company, the sales for 2022 witnessed a growth of 12.9% compared to the previous year, when sales surpassed approximately $52.70 billion. Further, the LG Home Appliance & Air Solution Company also recorded another record-breaking year with a revenue of $22.5 billion in 2022, marking a 10.3% increase from the previous year. Therefore, the growing demand for consumer electronics is driving the growth of the 3D IC and 2.5D IC packaging market.

Competitive Landscape -
Major companies operating in the 3d ic and 2.5d ic packaging market report are Samsung Electronics Co. Ltd., Siemens AG, Intel Corporation, Taiwan Semiconductor Manufacturing Company Limited, SK Hynix Inc., Broadcom Inc., Fujitsu Limited, Toshiba Corporation, ASE Technology Holding Co. Ltd., Texas Instruments Incorporated, STMicroelectronics NV, Infineon Technologies AG, Renesas Electronics Corporation, United Microelectronics Corporation, GlobalFoundries Inc., Amkor Technology Inc., Unimicron Technology Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Cadence Design Systems Inc., Siliconware Precision Industries Co. Ltd., Powertech Technology Inc., Ansys Inc., STATS ChipPAC Pte. Ltd., Synopsys Inc, UTAC Holdings Ltd., Tessolve Semiconductor Private Limited, Invensas Corporation, National Center for Advanced Packaging Co. Ltd., Tohoku-MicroTec Co. Ltd, TechSearch International Inc.

Technological Advancements In 3D Ic And 2.5D Ic Packaging Market
Technological advancements are a key trend gaining popularity in the 3D IC and 2.5D IC packaging market. Major companies operating in the 3D IC and 2.5D IC packaging market are adopting new technologies to sustain their position in the market. For instance, in June 2022, ASE Technology Holding Co. Ltd., a Taiwan-based provider of semiconductor manufacturing services, launched VIPack, an advanced packaging platform designed to enable vertically integrated package solutions. It is the next generation of 3D heterogeneous integration architecture from ASE that expands design guidelines and delivers exceptionally high performance and density. The platform enables companies to achieve unparalleled creativity when integrating several chips into a single package. It utilizes advanced redistribution layer (RDL) technologies, embedded integration, and 2.5D and 3D technologies. Six fundamental packaging technology pillars comprise ASE's VIPack, complemented by a wide-ranging co-design ecosystem. These include ASE's high-density through Silicon Via (TSV)-based 2.5D and 3D IC and Co-Packaged Optics processing capabilities, as well as Fanout Package-on-Package (FOPoP), Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP)-based technologies.

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Key Segments -
The 3d ic and 2.5d ic packaging market covered in this report is segmented -
1) By Technology: 3D Wafer-Level Chip-Scale Packaging, 3D TSV (Through-Silicon Via), 2.5D
2) By Application: Logic, Memory, Imaging And Optoelectronics, MEMS Or Sensors, LED, Other Applications
3) By End-user: Telecommunication, Consumer Electronics, Automotive, Military And Aerospace, Medical Devices, Smart Technologies, Other End Users

Key highlights covered in the report -
1. Detailed market size forecast and historical data analysis
2. Key drivers influencing market growth
3. Identification of upcoming trends and potential opportunities in the market
4. Analysis of major players strategies, to understand competitive dynamics and market positioning
5. Evaluation of regional dynamics

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