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Wafer Hybrid Bonding Equipment Market: Size, Share, Growth, Analysis, Key Players, Revenue, Growth | Valuates Reports
Wafer Hybrid Bonding Equipment Market SizeAccording to new survey, global Wafer Hybrid Bonding Equipment market is projected to reach US$ 1543.7 million in 2029, increasing from US$ 886 million in 2022, with the CAGR of 8.6% during the period of 2023 to 2029.
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Wafer Hybrid Bonding Equipment Market
Wafer hybrid bonding equipment is a kind of equipment used for bonding wafers in microelectronics manufacturing. It bonds two wafers together by using a bonding material such as adhesive or solder. This bonding process can be used to fabricate three-dimensional integrated circuits or other microelectronic devices. Wafer hybrid bonding equipment typically includes a loading system, a bonding system, a temperature control system, and a unloading system.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
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Segment by Type
• Fully Automatic
• Semi-automatic
Segment by Application
• 200 mm Wafer
• 300 mm Wafer
By Company
EV Group, SUSS MicroTec, Tokyo Electron, AML, Ayumi Industry, SMEE, TAZMO, Applied Microengineering Ltd, Nidec Machinetool Corporation, Hutem, Beijing U-Precision Tech
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