Press release
Flip Chip Market Analysis 2024 -2033: Forecasted Market Size, Top Segments, And Largest Region
Flip Chip Market
The Business Research Company offers in-depth market insights through Flip Chip Global Market Report 2024, providing businesses with a competitive advantage by thoroughly analyzing the market structure, including estimates for numerous segments and sub-segments.
Market Size And Growth Forecast:
The flip chip market size has grown rapidly in recent years. It will grow from $34.9 billion in 2023 to $38.88 billion in 2024 at a compound annual growth rate (CAGR) of 11.4%. The growth in the historic period can be attributed to miniaturization and size reduction, improved electrical performance, consumer electronics growth, improved heat dissipation, increased speed and data transmission.
The flip chip market size is expected to see rapid growth in the next few years. It will grow to $60.48 billion in 2028 at a compound annual growth rate (CAGR) of 11.7%. The growth in the forecast period can be attributed to automotive electronics, high-density interconnects, heterogeneous integration, 3d ic integration, semiconductor material advancements. Major trends in the forecast period include 5g and high-performance computing, internet of things (iot) expansion, advanced packaging technologies, ai and machine learning acceleration, quantum computing.
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Market Segmentation:
The main types flip chip packaging technologies include 3D IC, 2.5D IC and 2D IC. 3D IC are composed of an integrated circuit (IC) created in three dimensions by stacking various chips or wafers vertically into a single box. The different flip chip bumping technologies include copper pillar, solder bumping, tin-lead eutectic solder and lead-free solder. Flip chips are used by industries such as electronics, heavy machinery and equipment, IT and telecommunication, automotive and other industries.
Major Driver - Electronics Sales Surge Propelling Flip Chips Market Growth
The increase in sales of electronic products will propel the growth of the flip chips market during the forecast period. Flip chips are used in electronic equipment as it improves the presentation of portable electrical devices that operate at higher frequencies, allowing for greater use in ultrasonic and microwave operations. The technology exhibits high overall system efficiency and low inductance while taking up less space. According to Gartner, a US-based consulting firm estimated that the installed base of devices worldwide is expected to reach 6.4 billion units in 2022, an increase of 3.2% from 2021. Therefore, the increase in sales of electronic products drives growth in the flip chips market.
Competitive Landscape:
Major companies operating in the flip chip market include 3M Company, Advanced Micro Devices Inc., Amkor Technology Inc., Apple Inc., Fujitsu Limited., Intel Corporation, International Business Machines Corporation, Samsung Electronics Co. Ltd., Texas Instruments Incorporated, ASE Technology Holding Co. Ltd., Chipbond Technology Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd, Siliconware Precision Industries Co. Ltd., Unimicron Technology Corporation, Ibiden Co. Ltd., Nan Ya Printed Circuit Board Corporation, Shiko Electric Industries Co. Ltd., Austria Technologie & Systemtechnik AG, Kinsus Interconnect Technology Corporation, STATS ChipPAC Pte. Ltd., Powertech Technology Inc., UTAC Holdings Ltd, Taiwan Semiconductor Manufacturing Co., TF-AMD Microelectronics Sdn Bhd., Zhen Ding Technology Holding Ltd., Engent Inc., Masterwork Electronics, Advotech Company Inc., First Level Inc., Flipchip International LLC, Cormetech Inc., DCL International Inc.
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Top Trend - Innovative Technologies Propel Progress In The Flip Chip Market
Technological advancement is a key trend gaining popularity in the flip chip market. Companies in the flip chip market are focusing on developing technologies to strengthen their position in the market. For instance, In August 2021, ACM Research Inc., a US-based single-wafer wet cleaning equipment company, announced the launch of ACM's Ultra ECP GIII plating tool to support wafer-level packaging (WLP) including, product offers for silicon carbide (SiC), gallium nitride (GaN), and gallium arsenide for compound semiconductors (GaAs). The tool can plate gold (Au) into backside deep hole processes with uniformity and step coverage.
The Table Of Content For The Market Report Include:
1. Executive Summary
2. Flip Chip Market Characteristics
3. Flip Chip Market Trends And Strategies
4. Flip Chip Market - Macro Economic Scenario
5. Flip Chip Market Size And Growth
…..
27. Flip Chip Market Competitor Landscape And Company Profiles
28. Key Mergers And Acquisitions
29. Future Outlook and Potential Analysis
30. Appendix
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About The Business Research Company
The Business Research Company (www.thebusinessresearchcompany.com) is a market intelligence firm that pioneers in company, market, and consumer research. Located globally, TBRC's consultants specialize in various industries including manufacturing, healthcare, financial services, chemicals, and technology. The firm has offices located in the UK, the US, and India, along with a network of proficient researchers in 28 countries.
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