Epoxy Molding Compounds (EMC) Market: Size, Share, Growth, Analysis, Key Players, Revenue, Growth | Valuates Reports

Epoxy Molding Compounds (EMC) Market Size
The global Epoxy Molding Compounds (EMC) market was valued at US$ 2248.9 million in 2023 and is anticipated to reach US$ 3170.8 million by 2030, witnessing a CAGR of 4.7% during the forecast period 2024-2030.

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Epoxy Molding Compounds (EMC) Market
EMC (Epoxy Molding Compound) is a semi-conductor encapsulant which is used in most products where semi-conductors are applied, such as general home appliances including mobile phones, refrigerators and TVs, industrial devices and vehicles. With the development of IT technology and the development of electronic products based on modern technologies, the global semi-conductor market is expanding and the EMC demand is increasing.
Asia-Pacific is the largest Epoxy Molding Compounds market with about 86% market share. North America is follower, accounting for about 6% market share. The industry's leading producers are Sumitomo Bakelite, Showa Denko and Chang Chun Group, which accounted for 20%, 10% and 4% of revenue. In terms of product, solid EMC is the largest segment, with a share about 80%. And in terms of application, the largest application is non-memory, followed by discrete.
This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compounds (EMC), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compounds (EMC).
Report Scope
The Epoxy Molding Compounds (EMC) market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Epoxy Molding Compounds (EMC) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Epoxy Molding Compounds (EMC) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

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Segment by Type
• Solid EMC
• Liquid EMC

Segment by Application
• Memory
• Non-memory
• Discrete
• Power Module

By Company
Sumitomo Bakelite, Showa Denko, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI, Eternal Materials, Jiangsu zhongpeng new material, Shin-Etsu Chemical, Nagase ChemteX Corporation, HHCK, Scienchem, Beijing Sino-tech Electronic Material, Hysolem

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