Press release
TC Bonder - Global Market Insights and Sales Trends 2024
The global TC Bonder market size is expected to reach US$ 86 million by 2029, growing at a CAGR of 2.3% from 2023 to 2029.
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Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.
The market is mainly driven by the significant applications of TC Bonder in various end use industries. The expanding demands from the IDMs and OSAT, are propelling TC Bonder market. Automatic, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Manual segment is estimated at % CAGR for the next seven-year period.
Global Thermo Compression Bonder key players include ASMPT(Amicra), K&S, BESI, Shibaura, etc. Global top four manufacturers hold a share about 70%.
North America is the largest market, with a share about 47%
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By Type
• Automatic
• Manual
By Application
• IDMs
• OSAT
Key Players
• ASMPT (AMICRA)
• K&S
• Besi
• Shibaura
• SET
• Hanmi
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