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Global TC Bonder Market Insights, Forecast to 2029
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TC Bonder Market
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.
Global Thermo Compression Bonder key players include ASMPT(Amicra), K&S, BESI, Shibaura, etc. Global top four manufacturers hold a share about 70%.
North America is the largest market, with a share about 47%, followed by Europe and Asia-Pacific, both haveಭ
In terms of production side, this report researches the TC Bonder production, growth rate, market share by manufacturers and by region (region level and country level), from 2018 to 2023, and forecast to 2029.
In terms of consumption side, this report focuses on the sales of TC Bonder by region (region level and country level), by company, by Type and by Application. from 2018 to 2023 and forecast to 2029.
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Segment by Type
Automatic
Manual
Segment by Application
IDMs
OSAT
Production by Region
North America
Europe
China
Japan
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Middle East, Africa, Latin America
Brazil
Mexico
Turkey
Israel
GCC Countries
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https://reports.valuates.com/market-reports/QYRE-Auto-1Q14461/global-high-accuracy-thermo-compression-tc-bonder
https://reports.valuates.com/market-reports/QYRE-Auto-32V7684/global-tc-bonder
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