Photoactive Compound (PAC) market size is estimated to be worth US$ 207.19 Million million in 2021 and is forecast to a readjusted size of US$ 403.22 million by 2028 with a CAGR of 9.3%% - Valuates reports

Due to the COVID-19 pandemic, the global Photoactive Compound (PAC) market size is estimated to be worth US$ 207.19 Million million in 2021 and is forecast to a readjusted size of US$ 403.22 million by 2028 with a CAGR of 9.3%% during the forecast period 2022-2028.

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Major Trends in Photoactive Compound (PAC) Market
Diazonaphthoquinone and phenolic resin are the two primary components of the photoresist in this system, and the component containing the diazonaphthoquinone is known as a photosensitive compound (Photo-Active Compound, PAC). In actuality, it is merely one of the PAC's constituent parts. Additionally, phenolic skeleton compounds with many hydroxyl groups that can be coupled to diazonaphthoquinone are included in the composition of PAC. The reactivity of PAC can be adjusted by choosing framework compounds with various framework structures, numbers of substitution sites, and spacings between substitution sites, which in turn impacts the overall performance of the diazonaphthoquinone-phenolic resin photoresist.

The main components of the photoresist of the diazonaphthoquinone-phenolic resin system are diazonaphthoquinone and phenolic resin, and the component containing the diazonaphthoquinone is called a photosensitive compound (Photo-Active Compound, PAC). In fact, it is only one of the components of the photosensitive compound PAC. The composition of PAC also includes phenolic skeleton compounds, which have multiple hydroxyl groups that can be connected to diazonaphthoquinone. By selecting framework compounds with different framework structures, different numbers of substitution sites, and different substitution site spacings, the reactivity of PAC can be tuned, which in turn affects the overall performance of the diazonaphthoquinone-phenolic resin photoresist.

Photoactive Compound (PAC) Market Trends
A photoactive compound (PAC) and an alkaline-soluble resin are generally found in photoresists. The resin becomes insoluble when the PAC is added to it. This combination is applied to the semiconductor wafer as a coating, and a mask with the appropriate pattern is used to expose it to radiation. This factor is expected to drive the growth of Photoactive Compound (PAC) market

By imprinting the design of the circuit onto the semiconductor device, photolithography is used to build semiconductor devices and displays. To create a photosensitive film, the photoresist material is applied to the substrate of the LCD, OLED, semiconductor, etc.

The move toward nanoelectromechanical systems and microelectromechanical systems devices has been facilitated by the enormous market acceptance of nanotechnology. The use of nanodevices is expanding globally as a result of their smaller size, lighter weight, less power-intensive design, and reduced manufacturing costs. Along with other technological breakthroughs, the commercialization of such devices has increased the market potential for positive photoresist. The semiconductor industry's demand for positive photoresist is anticipated to increase as a result. This in turn will drive the growth of Photoactive Compound (PAC) market.

Segment by Type
g-Line
i-Line

Segment by Application
Photoresist for Semiconductor
Phororesist for FPD (TFT-LCD, OLED)
Photoresist for LED
Photoresist for PS Offset Plate

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