Panel Level Packaging Market Statistics 2023: Top Impacting Factors That Can Win the Industry Globally

The latest trend in packaging is panel level packaging, which is the promising area of market advancement in the global panel level packaging industry. Players such as ASE, Powertech, Nepes, and Samsung are looking forward to panel -level packaging, providing economies of scale.

Smaller form factor with enhanced thermal performance has generated huge demand for panel-level packaging technology among several industrial applications such as consumer electronics, automotive, aerospace & defense, telecommunication, and others.

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Players such as Mi Technovation Bhd are primarily involved in the design, manufacturing, and sale of the wafer level chip scale package and sorting machines with the inspection and testing capabilities for the semiconductor industry. Furthermore, Taiwan Semiconductor Manufacturing Company (TSMC) announced in October 2019 that it would increase its Capex, providing advanced solutions in the panel packaging.

Covid-19 Scenario:

➢ With the outbreak of COVID 19, the panel level packaging market witnessed a decline in growth due to restrictions on the movement of goods and severe disruptions in the semiconductor supply chain.

➢ COVID-19 caused low inventory levels for clients of semiconductor vendors and distribution channels. The semiconductor industry experiences a slowdown in demand and production disruption.

➢ However, in the pandemic period, panel level packaging finds its increased application in footprint-sensitive devices such as smartphones due to requirement of high-performing, energy-efficient thin- and small-form-factor packages.

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The report offers an all-inclusive analysis of the global panel level packaging Market taking into consideration all the crucial aspects like growth factors, constraints, market developments, top investment pockets, prospects, and trends. At the start, the report lays emphasis on the key trends and opportunities that may emerge soon and positively impact the overall industry growth. the high cost of portable computers than desktop computers and less reliability due to overheating act as major restraints for the panel level packaging market.

Key benefits of the report:

➢ This study presents the analytical depiction of panel level packaging market industry along with the current trends and future estimations to determine the imminent investment pockets.

➢ The report presents information related to key drivers, restraints, and opportunities along with detailed analysis of panel level packaging market.

➢ The current market is quantitatively analyzed to highlight of panel level packaging market growth scenario.

➢ Porter's Five Forces analysis illustrates the potency of buyers & suppliers in the market.

➢ The report provides a detailed panel level packaging market analysis based on competitive intensity and the competition that will take shape in coming years

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Several packaging houses are implementing panel-level fan-out, a low-density technology that promises to lower the cost of fan-out. Fan Out Panel Level Packaging (FOPLP) is expected to be essential for future applications on 5G, AI, Biotech, Advanced Driver- Assistance System (ADAS), smart city, and IoT related products. Ability to develop advanced packing and testing services and secure customer relations serve as major factors.

The semiconductors enable a wide variety of products for smartphones and computers and the demand for these devices is increasing year on year. A positive outlook for IoT and artificial intelligence increase the growth of the semiconductor industry which in turn would require intensive use of panel level technologies.

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Key drivers that are propelling the growth of the market are included in the report. Additionally, challenges and restraining factors that are likely to curb the growth of the market are put forth by the analysts to prepare the manufacturers for future challenges in advance.

Leading Market Players
➢ Siliconware Precision Industries

➢ Lam Research Corporation

➢ Qualcomm Technologies

➢ SPTS Technologies

➢ Samsung & TSMC

➢ Amkor Technology

➢ Deca Technologies

➢ STATS ChipPAC

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