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Build IOT-ready Devices with Lanner COM Solutions

08-01-2014 07:48 PM CET | IT, New Media & Software

Press release from: Lanner Electronics, Inc.

Lanner today announced the release of the latest COM Express® Computer-On-Modules solutions.

The VES-220 (type2) and the VES-270 (type 6) are highly integrated Computer-On-Modules (COM) that support system expansion and application-specific customizations. These two CPU modules are designed to work with the evaluation boards the VES-8X2 and the VES-8X6 respectively. They each complement the other, making available two embedded solutions that are highly customizable and flexible.

Both CPU modules are COM Express® R2.0 compatible with basic form factor (125mm x 95mm). The core functionalities are CPU based. The VES-220 comes with the Intel Atom D2550 dual-core CPU, known for its 15W low-power consumption. The VES-270, on the other hand, is built with the Intel® Core™ i7/i3 “Ivy Bridge” CPUs (i3-3120ME or the i7-3517UE), designed for computing tasks that require high CPU usage, ensuring there is no slow-down or hiccups in system performance.

Application-specific features are developed using evaluation boards such as the VES-8X2 and the VES-8X6, via the interface connectors for peripherals including storage, Ethernet, keyboard/mouse, display and PCI, PCI-express extension function.

Such COM + baseboard design is modular and it shortens time required for product development by allowing systems integrators to focus on how core competencies and unique functions should be integrated for a compact and high performance system; this modular approach greatly enhances productivity and significantly reduces products’ time-to-market.

For more information about Lanner's COM solutions, please visit:
http://www.lannerinc.com/news-and-events/latest-news/build-iot-ready-devices-with-lanner-com-solutions

Lanner Electronics Inc.

7F, 173 Datong Road Section 2
Xizhi District
New Taipei City
22184

contact@lannerinc.com
Brian Chen
+886-2-8692-6101

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