Bonding Sheet Market | Key players operating in the market include DuPont, Toray Industries Inc., NAMICS Corporation, Dexerials Corporation, Nitto Denko Corporation

The global Bonding Sheet Market size is projected to grow from USD 386 million in 2022 to USD 551 million by 2027, at a CAGR of 7.4% between 2022 and 2027. Emerging economies of Asia Pacific and Europe are expected to witness rising demand of bonding sheet owing to the developing electronics industry and applications in flexible printed circuit board (FPCs) and multi-layer FPCs. Additionally, rising demand for consumer electronics, electric vehicles, and miniaturization of electronic components are the major driver for the growth of bonding sheet market. Advancement in telecommunication such as 5G technology is also expected to increase the demand of bonding sheet for during the forecast period. However, geopolitical uncertainties, and high capital investment hinders the growth of the market.

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In terms of value, the polyimides segment is projected to account for the largest share of the bonding sheet market, by adhesive material, during the forecast period.

Polyimide bonding sheet are polymer-based materials which are flexible, chemical resistant, heat resistant, and lightweight. They are primarily used for insulation and passivation in various applications in electronics/optoelectronics, automotive, and others. They have high mechanical and tensile strength due to which they are utilized in the manufacture of sensors, chips, wires, and cables.

25µm (1mil) adhesive thickness is projected to register the highest CAGR during the forecast period.

Bonding sheet with adhesive thickness 25 µM offers heat-resistant properties and is thus ideal for fixing backing materials and terminals, FPCs, and stiffeners which are required to undergo heat treatment. Dexerials Corporation offers acrylic- and epoxy-based 25 µM bonding sheet under the brand, D3451 and is ideal for hot press, quick press, and oven-curing. NIKKAN INDUSTRIES Co., Ltd. offers thermosetting resin type bonding sheet under the brand, NIKAFLEX SA-series for multilayer FPCs.

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Electronics/Optoelectronics is projected to be the largest application.

Bonding sheet are ideally used during the fabrication process of electronics materials such as printed circuit boards (PCBs), heat sinks, rigid-flex boards, FPCs, and others. Bonding sheet are designed to bond metal foils to base materials to create a laminate or layers of laminates in flexible printed circuits. They are manufactured in various adhesive thicknesses, materials, and applications. They are generally supplied in the form of rolls stored at temperatures ranging from 40 to 85°F in dry and clean environments to protect the bonding sheet from losing their functional characteristics.

The APAC region is estimated to register the highest CAGR.

APAC is the fastest-growing region for bonding sheet market. The region consists of the majority of emerging economies of the world such as China, Japan, India, South Korea, Malaysia, and Australia, and is projected to register the highest CAGR for bonding sheet in the next five years. The easy availability of raw materials, low labor costs, and a moderately stringent regulatory framework in these developing countries are some of the factors driving the market.

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Major players operating in the global bonding sheet market include Arisawa Manufacturing Co. (Japan), DuPont (US), NIKKAN INDUSTRIES Co., Ltd. (Japan), Dexerials Corporation (Japan), Nitto Denko Corporation (Japan), Showa Denko Materials Co., Ltd. (Japan), Toray Industries, Inc. (Japan), NAMICS Corporation (Japan), and Shin-Etsu Polymer Co., Ltd. (Japan) among many others.

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