Global Panel Level Packaging Market 2022 Insights and Business Scenario - Amkor Technology, Deca Technologies, Lam Research Corporation, ASE Group

Global Panel Level Packaging Market Size, Status, and Forecast for the 2022-2028.  In-depth research has been compiled to provide the most up-to-date information on key aspects of the worldwide market. This research report covers major aspects of the Panel Level Packaging Market, including drivers, restraints, demand, size, trading, regulatory scenarios, and technological advancements. "The report takes into consideration the previous and current years' data and trends to predict the future market possibilities."

The panel level packaging (PLP) market is anticipated to register a CAGR of 28.0% over the forecast period from 2022 to 2027.

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The Top Major Prominent Players are:  Amkor Technology, Inc., Deca Technologies, Lam Research Corporation, ASE Group, Siliconware Precision Industries Co., Ltd., Fraunhofer Institute for Reliability and Microintegration IZM, Taiwan Semiconductor Manufacturing Company, Limited, Shinko Electric Industries Co, Ltd.

Industry News and Update:

- May 2022 - Taiwan Semiconductor Manufacturing (TSMC) announced plans to build a USD 12 billion factory in Arizona with support from the state and the US government. TSMC said the plant would be able to produce 20,000 semiconductor wafers a month, directly employing more than 1,600 people.

- October 2019 - Deca Technologies has reached an agreement with nepes Corporation whereby nepes will expand its geographic footprint and manufacturing capabilities by taking over the operations of Deca TechnologiesÕ Philippines manufacturing facility.Nepes acquired the fan-out manufacturing line from Deca. Nepes also licensed DecaÕs wafer and panel level fan-out technology.

Key Market Trends

Consumer Electronics is Expected to Hold Major Share

- Mobile consumer electronics are powering a new wave of developments in electronic packaging. In the United States, with increasing consumer electronic sales year on year, the demand for panel-level packaging significantly rises. Further, Berlin's Fraunhofer IZM is the place to be for leading industry players wishing in developing the fundamental processes for the new panel-level packaging and creates viable first demonstrators on large-scale organic substrate formats in the consumer electronics. After the successful venture for two years, the consortium is focused on embracing new members with new research avenues.
- Moreover, at the start of 2022, TSMC was investing heavily in 5nm fabrication. TSMC's 7nm process is at its peak, receiving vast numbers of orders from AMD for its Ryzen 3000-series CPUs and Navi graphics cards and other customers, including Apple and Huawei. On the 5nm front, TSMC is working with EUV lithography, similar to what Samsung is accomplishing, and the company expects 10% of 2022's year's revenue to come from its 5nm EUV lines. After the 3nm process takes over, TSMC expects mass production to start in 2022. This significantly drives the market in the future period.
- Also recently, SEMCO achieved a new milestone by rolling out APE-PMIC devices with FO (Fan-Out) embedded panel-level packaging (ePLP) PoP technology for Samsung Galaxy Watch. SEMCO announced to continue to innovate for a cost-effective HDFO market space to compete with TSMC for Apple's packaging and FE business again. In years to come, SEMCO's HDFO is anticipated to be utilized first in Samsung's cellphones. Besides, a restructure between SEMCO, and Samsung Electronics could be favorable for Samsung's position as the full turnkey provider for a FE+BE bundle.

Regional Analysis for Panel Level Packaging Market:

For a comprehensive understanding of market dynamics, the global Panel Level Packaging market is analyzed across key geographies namely the United States, Europe, China, Japan, Southeast Asia, India, Central & South America. Each of these regions is analyzed based on market findings across major countries in these regions for a macro-level understanding of the market.

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Strategic points covered in the Panel Level Packaging market catalogue:

Introduction, market driving force product research goals and research scope Global Panel Level Packaging market (2022-2028).

Exclusive Summary - Basic information on the global Panel Level Packaging market.

The changing impact on market dynamics - global party supplies driving factors, trends, challenges and opportunities; post-COVID analysis.

Introduction Global Panel Level Packaging market factors, after COVID impact analysis, Porter's five force, the supply / value chain, PESTEL analysis, market entropy, patent / trademark analysis.

Show 2016-2022 by type, end user and region/country.

Assess the leading manufacturers of the global Panel Level Packaging market, including their competitive landscape, peer analysis, BCG matrix and company profile.

Evaluate the market-by-market segments, countries/regions and manufacturers/companies, the revenue share and sales of these companies/companies in these different regions of the main countries/regions (2022-2028).

... To be continued

Table of Contents Panel Level Packaging Market

Chapter 1: Panel Level Packaging Market Overview, Drivers, Restrictions and Opportunities, Segmentation Overview

Chapter 2: Market competition by manufacturers

Chapter 3: Production by regions

Chapter 4: Consumption by Regions

Chapter 5: Production, by types, revenue and market share by types

Chapter 6: Consumption, by applications, market share (%) and growth rate by applications

Chapter 7: Profiling and comprehensive analysis of Producers

Chapter 8: Production Cost Analysis, Raw Material Analysis, Regional Production Expenses.

Chapter 9: Industrial chain, sourcing strategy and downstream buyers

Chapter 10: Marketing strategy analysis, distributors / merchants

Chapter 11: Market Effect Factors Analysis

Chapter 12: Market Forecasts

Chapter 13:  Panel Level Packaging Market Research findings and conclusions, Appendix, methodology and data source.

Keep it going…

Finally, the researchers shed information on Global Panel Level Packaging ' precise analysis. It also assesses the long-term patterns and platforms that support market expansion. The research report also assesses the level of competitiveness. The market has been thoroughly examined using SWOT analysis and Porter's five scanning. It also aids in the management of company risks and obstacles. It also includes considerable research on sales techniques

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