Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market : Industry Development Scenario and Forecast

SDKI Inc. published a new research report on "Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Market-Global Forecast 2030". The report provides a complete assessment of the market and its growth prospects, along with new business opportunities in the industry. It also includes market size and annual growth during the 2022-2030 forecast period.

Report sample URL
https://www.sdki.jp/sample-request-109477

The hybrid memory cube (HMC) and high bandwidth memory (HBM) market is estimated to reach US $ 16,004 million by 2030, from a market value of US $ 2,171.7 million in 2022, at a compound annual growth rate of 33.02%. Expected to grow at CAGR.

The growing need for high bandwidth, low power consumption, and highly scalable memory is a driver of market growth. In addition, the increasing adoption of artificial intelligence and the growing trend toward smaller electronic devices are also contributing to the growth of the market. Increasing acceptance of artificial intelligence is a key factor in escalating market growth. Electronic device miniatures are also trending, and high bandwidth, low power consumption, and growing demand for highly scalable memory are expected to contribute to market growth. In addition, the growing focus on digitalization will create new growth opportunities for the HMC and HBM markets during the forecast period.

Market Segments

The HMC and HBM markets are by memory type (HMC and HBM), product type (GPU, CPU, APU, FPGA, ASIC), application (graphics, high performance computing, networking, data center), and region. It will be split separately. These segments are further subsegmented based on various factors and consist of some additional information about the market, such as the combined annual growth rate of each segment and subsegment, the market value and volume of the valuation period.

Based on the memory type, the HBM segment is expected to grow at a high CAGR during the forecast period.

Recently, the main use of HBM is graphics. With improved specifications, HBM has begun to gain attention in high performance computing, cloud computing, and networking. The adoption of HBM technology in these applications is expected to increase further in the coming years. In addition, HBM is priced at a lower cost than HMC, allowing enterprises to integrate HBM into high-end products. These factors are expected to contribute to the growth of this segment.

Based on product type, the CPU segment had the largest share in 2017.

The high market share of CPUs is due to the significant adoption of CPUs in high performance computing in the data center. Developed for this particular application, HMC supports advanced and intensive real-time operations. The CPU plays an important role in blocking the way content is processed. More applications and content utilities require more processing power on the CPU. As a result, advanced CPUs widely employ HMC and HBM technologies to improve server CPU performance rather than increasing the number of CPUs.

Area overview

In addition, the report covers all regions of the world, divided into North America, Europe, Asia Pacific, Latin America, Middle East & Africa and more. The North American market is expected to have the largest share during the forecast period. The high adoption of HMC and HBM memory in North America is largely due to the growth of high performance computing (HPC) applications that require high bandwidth memory solutions for high speed data processing. Demand for HPC in North America is expanding due to the expansion of the AI, machine learning and cloud computing markets. In addition, major HPC-based CPU and processor providers such as Intel are based in North American countries.

For more detailed analysis, each region is further divided into countries:
Asia Pacific (China, India, Japan, South Korea, Indonesia, Malaysia, Australia, New Zealand, and other Asia Pacific)
North America (US and Canada)
Middle East and Africa (Israel, GCC [Saudi Arabia, United Arab Emirates, Bahrain, Kuwait, Qatar, Oman], North Africa, South Africa, and other Middle East and Africa)
Latin America (Brazil, Mexico, Argentina, and other Latin America)
Europe (UK, Germany, France, Italy, Spain, Hungary, Belgium, Netherlands, Luxemburg, NORDIC, Poland, Turkey, Russia and other Europe)

Key Players on the Market

The key players on the HMC and HBM markets are Micron (US), Samsung (Korea), SK Hynix (Korea), Intel (US), AMD (US), Fujitsu (Japan), IBM. These include (US), NVIDIA (US), Xilinx (US), and Open-Silicon (US). The survey includes a detailed competitive analysis of these key companies in the HMC and HBM markets, corporate profiles, recent developments, and key market strategies.

Detailed contents of the survey report
https://www.sdki.jp/reports/hybrid-memory-cube-hmc-and-high-bandwidth-memory-hbm-market/109477

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This release was published on openPR.