Global Flip Chip Technology Market was valued at USD 20.61 billion in 2017 and expected to grow at CAGR 5.9% over the forecast period 2021–2026.

Flip Chip Market 2021

This Newly added report provided by Straits Research Flip Chip market Presents an Analysis of Market Situation and Challenges. Experts have studied the historical data and compared it with the Current Market Situation- 2021. The Research Report covers all the necessary information and remarkable data required by new market entrants as well as the existing players to gain a deeper insight into the market.

Flip chips offer a wide variety of benefits as compared to wire-bond packagings, such as substrate flexibility, superior electrical and thermal and electrical performance, high speed and reliability. Current leading-edge flip-chip designs are in production with as many as 5,908 bumps/chip at 200-µm pitch and 1,500 bumps/chip at 170-µm pitch in area array configurations.

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The Major Manufacturers Covered in this Report:
Intel Corporation, IBM Corporation, Amkor Technology Inc., Taiwan Semiconductor Manufacturing Company Limited, Samsung Electronics Co. Ltd, Texas Instruments Inc., GlobalFoundries U.S. Inc., Stats ChipPAC Ltd, Nepes Pte Ltd., and Powertech Technology

Years that have been considered for the study of this report are as follows:

History Year: 2015-2019
Base Year: 2019
Estimated Year: 2020
Forecast Year: 2021 to 2026

Market Segmentation:

By Packaging Technology

3D IC
5D IC
2D IC

By Bumping Technology

Copper Pillar
Solder Bumping
Tin-Lead Eutectic Solder
Lead-Free Solder

By Industry

Electronics
Heavy Machinery and Equipment
IT and Telecommunication
Automotive
Others

Regional Segmentation:

North America (The US, Canada, and Mexico)
Europe (Germany, France, the UK, and Rest of the World)
Asia Pacific (China, Japan, India, and Rest of Asia Pacific)
Latin America (Brazil and Rest of Latin America.)
Middle East & Africa (Saudi Arabia, the UAE, South Africa, and Rest of Middle East & Africa)

Additionally, the analysis also delivers a comprehensive review of the crucial players on the Flip Chip Market along with their company profiles, SWOT analysis, latest advancement and business plans.

The analysis objectives of the report are:

To equitably share in-depth info regarding the crucial elements impacting the increase of industry (growth capacity, chances, drivers and industry specific challenge and risks).
To know the Flip Chip Market by pinpointing its many sub segments.
To profile the important players and analyze their growth plans.
To endeavor the amount and value of the Flip Chip Market sub-markets, depending on key regions (various vital states).
To analyze the Global Flip Chip Market concerning growth trends, prospects and also their participation in the entire sector.
To examine and study the Global Flip Chip Market size (volume and value) form the company, essential regions/countries, products and applications, background information and also predictions.
Primary worldwide Global Flip Chip Market manufacturing companies, to specify, clarify and analyze the product sales amount, value and market share, market rivalry landscape, SWOT analysis and development plans for the next coming years.
To examine competitive progress such as expansions, arrangements, new product launches and acquisitions on the market.

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This release was published on openPR.