Press release
Analysis of the 2021 Component Shortage in the Communication Industry and Its Outlook
Supply chains in the communications industry faced a near perfect storm in 2020 caused by the coronavirus pandemic and U.S.-China trade war. In the first quarter of 2021, those same factors continue to adversely affect the industry, despite the revenue growth brought by WFH (Work-From-Home) and 5G products. If upstream suppliers’ component shortage causes suppliers of finished products to be unable to deliver orders, most vendors will have to take on potential operational risk. This report looks into some of the reasons the shortage exists, an overview of the impact on the communications equipment, and examines the component supply and shortage in 2021.Table of Contents
1. Component Shortage in the Communications Sector in 2020
1.1 The Key Reasons for the Shortage
1.2 The Impact on Communications Equipment Makers
2.Component Supply in 2021
2.1 The Current Supply Status of Key Components
2.2 Shortage Impact on Communications Equipment
3.MIC Perspective
Appendix
Glossary of Terms
List of Companies
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List of Topics
Development of component shortage in 2020, touching on key reasons and impact on equipment manufacturers
Development of component supply in 2021, touching on key components and the anticipated lead time of key components such as communications ICs, microcontroller ICs, CPU/GPU, panel, and printed circuit boards, memory ICs, power management ICs, and MLCC, and companies affected are also included.
Leading chipmakers and brands’ views on component shortage, including Foxconn, Nokia, Intel, Qualcomm, and Broadcom
Possible development of key component shortage in 2021 and beyond
List of Figures
Figure 1 Diagram of the Impact of COVID-19 on Broadband Traffic
List of Tables
Table 1. Lead-Time of Communication Chips and Key Components (as of the end of March 2021)
Table 2. Comments of Leading Brands on Component Shortage
Companies covered
ADI
AMD
Anpec Electronics
AT&T
Broadcom
Compeq
Dell
Elan
Ericsson
Foxconn
Global Mixed-mode Technology
HiSilicon
Holtek
Huawei
Infineon
Intel
MediaTek
Micron
Microsoft
Murata
Nanya
Nokia
Nuvoton
Nvidia
NXP
Oppo
Qualcomm
Realtek
Samsung
Semco
SG Micro
Silergy
SK Hynix
Taiyo Yuden
TI
TTM
Unimicron
Vivo
Walsin Technology
Winbond
Xiaomi
Yageo
ZTE
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