Silicon Epitaxial Wafer Market 2021 Emerging Trends and Technology to 2025

Silicon Epitaxial Wafer Market - Growth, Trends, and Forecasts (2020 - 2025)

The report will make detailed analysis mainly on in-depth research on the development environment, Market size, development trend, operation situation and future development trend of Silicon Epitaxial Wafer Market on the basis of stating current situation of the industry in 2021.

This is a latest report, covering the current COVID-19 impact on the market. The pandemic of Coronavirus (COVID-19) has affected every aspect of life globally. This has brought along several changes in market conditions. The rapidly changing market scenario and initial and future assessment of the impact is covered in the report. It offers critical information pertaining to the current and future growth of the market.

The silicon epitaxial wafer market is expected to register a CAGR of 4.42% during the forecast period from 2020 to 2025.

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Competitive Landscape

The silicon epitaxial wafer market is moderately competitive and consists of a significant amount of major players. In terms of market share, none of the major players currently dominate the market. Along with an increased focus on product innovation, the companies are also getting engaged in mergers and acquisitions to stay competitive.
- May 2020 - SweGaN AB which manufactures custom gallium nitride on silicon carbide (GaN-on-SiC) epitaxial wafers for RF and power electronics devices, has announced a new benchmark for GaN high-frequency devices based on its QuanFINE material, reckoning that the demonstration promises commercial benefits for the entire GaN RF value chains including telecom, space, and military markets.
- March 2020 - Intel recognized 37 suppliers for their exceptional commitment to quality and performance in 2019. One among them was SUMCO Corporation for the supply of the 200mm and 300mm epitaxial and polished silicon wafers.

The growing demand for advanced semiconductors and increasing innovative end-user applications are significant factors driving the market studied. Epitaxial is mainly done to enhance the functionality of wafers. In recent years, technology has become essential for the manufacturing of highly integrated semiconductor elements (ICs), image sensors (CIS), and specific power semiconductors.
- The overall semiconductor industry has been witnessing a decline from the previous year, which is further expected to continue in 2020, due to the COVID-19 outbreak. However, globally, the silicon wafer shipments rebounded slightly in Q1 2020, after declining for one year. Logic, analog ICs, discrete components, microprocessors, image sensors, power and optoelectronics, and IGBTs, among others, are some of the significant applications of epitaxial wafers that have gained market momentum in recent years. In 2019, memory devices contributed a substantial portion of the overall demand for ICs. However, all of these categories are witnessing a declining growth rate from the last two years, the trend that is expected to continue in 2020.

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Key Market Trends: 

Power Electronics is Expected to Significant Share
- The growing need for power-efficient products is one of the major factors driving the demand for the epitaxial wafer for power electronics products, across all the end-user industries. Therefore, the vendors of the market studied are targeting a wide range of industries, to mitigate risk and expand their customer base. The IGBT and MOSFET markets may continue to increase, but a part of the market is expected to go to SiC, especially when discussing modules for EV/ HEV. Moreover, the demand for power MOSFET is supported by its growing use in replacing insulated-gate, bipolar transistors, and thyristors. Additionally, the significant advantage of using power MOSFET in reinforcing the power efficiency of devices at low voltages further drives the demand for the global power MOSFET market.
- The increasing usage of power electronics in consumer electronic devices is also fuelling the demand. The growing penetration of smartphones and smart devices, increasing the adoption of IoT devices, and increasing industrial usage is also a developing market for power electronics. The high demand for power electronics devices has also resulted in a shortage of 200 mm wafers, in 2018 and 2019. The customer demand is falling because major customers still have equipment vast inventory. The long-term growth in the power electronics market is also driving 300 mm wafer-based production. More than seven global power electronics vendors have announced an investment in new fabrication capabilities to be in production from 2021.
- For instance, in 2018, Infineon began the construction of a fully automated 300-millimeter, thin-wafer manufacturing facility at the Villach site. The company is also planning to ramp the fab by late 2021, with a EUR 1.6 billion investment. In June 2019, the company also joined EUR 74 million European research project "Power2Power", which is mainly focusing on developing innovative power electronics, with highest power densities and energy efficiencies, using silicon-based IGBT technology. The project size totals approximately EUR 74 million. The company is also expanding its R&D expertise for power electronic enabled radio-frequency components at the Linz site. It mainly focuses on 77 gigahertz radar sensor ICs for driver assistance systems and on radio-frequency components for smartphones, tablets, and navigation applications.
- Imec and Qromis have collaborated for the developed enhancement-mode, p-GaN discrete, and IC power devices on 200 mm QST substrates, with epitaxy layers grown in Aixtron's G5+ C 200 mm MOVCD platform. Both the companies have been working on device fabrication, developing GaN power devices, indiscreet and monolithically-integrated ICs forms, and on 200 mm QST substrates in an advanced CMOS silicon pilot line. Imec and Qromis have collaborated with Germany-based GaN MOCVD equipment manufacturer, Aixtron, on GaN-on-QST epitaxy development. Many industrial experts claim that the number of integrated circuits (IC) semiconductor fabrication plants processing 300 mm wafers worldwide are expected to grow from 15 in 2002 to 138 by 2023.

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