Flip Chip Market 2027 Getting Ready for Future Growth | 3M, AMD, Inc., Amkor Packaging Technology, Apple, Fujitsu, IBM Corp, Intel Corp, Samsung electronics, TSMC, and Texas Instruments
Industry Growth Drivers and Challenges
Increase in demand for high speed and compact size electronic products has boosted the adoption of flip chip technology in the electronic industry. Internet of Things (IoT) has been gaining popularity, and serves as a key driver of the market. Products used in IoT, such as sensors & actuators, analog & mixed-signal translators, and microcontrollers or embedded processors require efficient and reliable packaging solutions, which can be done using flip chips.
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Major Players and Their Growth Strategies
Some of the key market players profiled in the flip chip industry include 3M, AMD, Inc., Amkor Packaging Technology, Inc., Apple, Inc., Fujitsu Ltd, IBM Corporation, Intel Corporation, Samsung electronics Co., Ltd, TSMC, Ltd,, and Texas Instruments, Inc.
Major players operating in this market have witnessed significant adoption of strategies such as business expansion and partnership to reduce supply and demand gap. With increase in digitalization initiatives and industry revolution across the globe, major players have collaborated their product portfolio to provide differentiated and innovative products.
COVID-19 Pandemic disrupted the entire world and affected many industries.
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Key Benefits For Stakeholders
• This study includes the flip chip market trends, opportunity, analysis, and future estimations to determine the imminent investment pockets.
• The report presents information related to key drivers, restraints, and opportunities of the flip chip industry.
• The flip chip market share is quantitatively analyzed from 2019 to 2027 to highlight the financial competency of the industry.
• Porter’s five forces analysis illustrates the potency of the buyers & suppliers in the flip chip market.
Key Features of Flip Chip Market
In comparison to customary wire-bond packaging, flip chip offers various benefits such as, superior thermal & electrical performance, substrate flexibility for varying performance requirements, remarkable I/O capability, reduced form factors, and well-established process equipment expertise.
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Gold bumping technology contributes to the second-largest share, who is first?
Gold bumping technology contributes the second largest share in overall flip chip market. The gold bumping segment is expected to witness sluggish growth rate as compared to other bumping technologies, owing to their high manufacturing cost, fragile construction, and complexities involved in bumping process. In addition, improved heat dissipation of ball grid array type flip chips makes them suitable choice in applications where smaller size chips are preferred without the need for external heat sink.
Solder bumping technology segment garners the third largest share
The solder bumping technology segment garners the third largest share in the global flip chip market. This is attributed to low cost of solder bumping technology and considerably improved bonding efficiency.
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Asia-Pacific Region Hold Lions Share
Asia-Pacific region dominates the flip chip market in terms of number of manufacturer and in terms of consumers. In 2019, reduction in China’s supply chain significantly impacted on companies across the globe and disrupted the electronics value chain. The outbreak of corona virus constrained governments across the globe to force lockdown initiatives which halted many production facilities operations which in tun disrupted the worldwide economy at a significant extent.
Moreover, industries such as manufacturing and construction across the globe have witnessed shortage of labors and various hardware components from supplier side. This hindered the market growth to a certain extent, but is further expected to adjust the growth of flip chip market in the coming years.
Key Findings of The Study
• By packaging technology, the 2.5D IC segment dominated the flip chip market growth. However, the 2D IC segment is expected to exhibit significant growth during the forecast period.
• Depending on bumping technology, the copper pillar segment led the flip chip market share in 2019. However, the gold bumping segment is expected to display highest growth during the forecast period.
• On the basis of industry, the electronics segment witnessed significant growth in the flip chip market trends. However, the IT & telecommunication segment is anticipated to dominate the market during the forecast period in the industry.
• Region wise, Asia-Pacific dominated the flip chip market size in 2019. However, North America is expected to witness significant growth in terms of revenue in the coming years owing to high demand for smart electronics in this region.
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Key Market Segments
By Packaging Technology
• 3D IC
• 2.5D IC
• 2D IC
By Bumping Technology
• Copper Pillar
• Solder Bumping
• Gold Bumping
• Others (Aluminum & Conductive Polymer)
• Automotive & Transport
• IT & Telecommunication
• Aerospace & Defense
• North America
o Rest of Europe
o Rest of Asia-Pacific
o Latin America
o Middle East
Key Market Players
• Advanced Micro Devices, Inc.
• Amkor Technology
• Apple Inc.
• Fujitsu Limited
• Intel Corporation
• International Business Machines Corporation
• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Manufacturing Company Limited
• Texas Instruments Incorporated
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