Huge Investment Opportunity after COVID-19 Crisis: Flip Chip Market Expected to Reach $39.67 Billion by 2027

Flip chip holds promising potential as packaging technology in changing the scenario of conventional electrical interconnection solutions. The fundamental properties of flip chip make it a potential interconnection packaging technology for different industry verticals.

According to a recent report published by Allied Market Research, titled, “Flip Chip Market by Packaging Technology, Bumping Technology, and Industry: Opportunity Analysis and Industry Forecast, 2020–2027,” the flip chip market size was valued at $24.76 billion in 2019, and is projected to reach $39.67 billion by 2027, growing at a CAGR of 6.1% from 2020 to 2027.

Some of the key market players profiled in the flip chip industry include 3M, AMD, Inc., Amkor Packaging Technology, Inc., Apple, Inc., Fujitsu Ltd, IBM Corporation, Intel Corporation, Samsung electronics Co., Ltd, TSMC, Ltd,, and Texas Instruments, Inc.

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Major players operating in this market have witnessed significant adoption of strategies such as business expansion and partnership to reduce supply and demand gap. With increase in digitalization initiatives and industry revolution across the globe, major players have collaborated their product portfolio to provide differentiated and innovative products.

Flip chip is one of the most studied packaging technologies for electrical interconnections due to its potential to change the current packaging market landscape. It offers several advantages, such as smaller IC footprint, reduced size, improved performance, superior reliability, and thermal capabilities for electronic devices such as smartphones, digital camera & camcorders, and laptops & tablets. The copper pillar segment is expected to witness highest growth, owing to smaller pitch, enhanced performance, and cost-effectiveness. 3D IC packaging is expected to account for significant market share in the near future, owing to rise in application of 3D IC among miniature consumer electronics.

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Flip chip has promising scope in IoT due to its varied application in consumer electronics, automotive & transport, industrial, healthcare, aerospace & defense, and renewable energy resources. The executive, Oommen Mathews, lead specialist for advanced silicon packaging at Intel Corporation stated that “Internet of Things (IoT) is the main driver of the flip chip market, owing to high performance, small packaging size, and hybrid integration capability of flip chips.” The growth of the flip chip market is majorly driven by the emerging concept of IOT, which is a network of physical devices, vehicles, buildings, and others, including embedded electronics, software, sensors, actuators, and network connectivity.

The adoption rate of flip chip is affected by bumping cost and assembly process cost. Key market players are focusing on launching efficient and advanced packaging solutions to sustain the stiff competition in the market. Flip chip finds its major application in the electronic packaging and electrical interconnections. Copper pillar bump is a next-generation flip chip interconnect, which offers advantages in design to cater to the current and future electronic device requirements. It is a remarkable interconnect choice for applications such as transceivers, embedded processors, and electrical processors.

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Key Benefits For Stakeholders

• This study includes the flip chip market trends, opportunity, analysis, and future estimations to determine the imminent investment pockets.

• The report presents information related to key drivers, restraints, and opportunities of the flip chip industry.

• The flip chip market share is quantitatively analyzed from 2019 to 2027 to highlight the financial competency of the industry.

• Porter’s five forces analysis illustrates the potency of the buyers & suppliers in the flip chip market.

Key Findings of The Study

• By packaging technology, the 2.5D IC segment dominated the flip chip market growth. However, the 2D IC segment is expected to exhibit significant growth during the forecast period.

• Depending on bumping technology, the copper pillar segment led the flip chip market share in 2019. However, the gold bumping segment is expected to display highest growth during the forecast period.

• On the basis of industry, the electronics segment witnessed significant growth in the flip chip market trends. However, the IT & telecommunication segment is anticipated to dominate the market during the forecast period in the industry.

• Region wise, Asia-Pacific dominated the flip chip market size in 2019. However, North America is expected to witness significant growth in terms of revenue in the coming years owing to high demand for smart electronics in this region.

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Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of "Market Research Reports" and "Business Intelligence Solutions." AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

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