New Era of 3D Integrated Circuit Market 2020-2025: Technological Advancement and Prominent Key Players: STMicroelectronics, Amkor Tech, United Microelectronics, Texas Instruments, Toshiba, Samsung

Global 3D Integrated Circuit Market Synopsis:

The report covers a forecast and an analysis of the 3D Integrated Circuit Market on a global and regional level. The study provides historical data for 2015, 2016, 2017 and 2018 along with a forecast from 2020 to 2025 based on revenue (USD Million) and volume (Kilotons). The study includes drivers and restraints of the 3D Integrated Circuit Market along with the impact they have on the demand over the forecast period. Additionally, the report includes the study of opportunities available in the 3D Integrated Circuit Market on a global level.

The most important key factors driving the growth of the Global 3D Integrated Circuit Market are rapid growth in the semiconductor & microelectronics industry, advanced development in 3D packaging and increasing demand for advanced electronic products. 3D Integrated Circuit is a component in microelectronics which is manufactured by assembling silicon wafers or dies and connecting them vertically by using copper to copper connections or Through-Silicon Via (TSVs). It acts as a single device to reduce power consumption and improve performance than two-dimensional processes. Global 3D Integrated Circuit Market has shown commendable growth since last few decades and is expected to grow at a decent pace in the near future.

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In terms of the regional analysis, 3D Integrated Circuit Market is growing in the APAC region. This is majorly owing to the existence of major companies such as Samsung, United Microelectronics Corporation, etc. in the region. There are many more companies that are present in the region which addresses the issues associated with the manufacturing of the 3D Integrated Circuit in a cost effective manner. The other regions such as North America and Europe also contribute their share in the 3D Integrated Circuit Market growth.

This report contains a complete product overview and its scope in the market to define the key terms and provide the clients a holistic idea of the market and its tendency. It comprehensively evaluates the Global 3D Integrated Circuit Market with different perspectives for the purpose of providing a detailed, informative, and accurate analysis of regional growth, competition, market segmentation, and other important aspects.

Global Key Players:

1 Jiangsu Changjiang Electronics Technology Corporation

2 Amkor Technology

3 United Microelectronics Corporation

4 STMicroelectronics

5 Texas Instruments

6 Samsung Electronics

7 Taiwan Semiconductor Manufacturing

8 Toshiba

9 Advanced Semiconductor Engineering and More................

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Product Type Segmentation

1 Through Silicon Via

2 Silicon Interposer

3 Through Glass Via

Industry Segmentation

1 Sensor

2 LED

3 MEMS

4 Memory

On the basis of Regional analysis, North America and Europe holds major share in global 3D Integrated Circuit market. Moreover, Asia-Pacific is expected to record higher growth rate in 3D Integrated Circuit Market during the forecast year.

International Electronic Industry News:

STMicroelectronics (May 11, 2020) - STMicroelectronics Boosts Power Efficiency in Space Applications with New Radiation-Hardened Devices - STMicroelectronics has extended its portfolio of radiation-hardened power devices qualified for space applications by introducing new ESCC (European Space Components Coordination) qualified 200V and 400V power rectifiers and SEB -immune Schottky rectifiers at 45V and 150V.

The rad-hard Schottky diodes include 45V and 150V devices, SEB immune up to 61MeV/cm2/mg linear energy transfer (LET). These are the industry's first SEB-rated Schottky devices and are suited to use in many converter topologies. The 150V and 45V devices are ready for direct connection to 100V and 28V satellite power buses. The forward voltage (VF) of the 150V devices is 0.78V (max) at 40A/125�C. The maximum VF for the 45V devices is 0.61V.

In total ST is launching five ESCC-qualified dual common-cathode Schottky parts including the STPS40A45C that contains a 45V/2x20A diode in a TO-254AA through-hole package. The STPS80A45C with a 45V/2x40A diode, STPS60A150C 150V/2x30A, and STPS80A150C 150V/2x40A are packaged as SMD.5 hermetic surface-mount devices. The STPS40A150C 150V/2x20A is offered in TO254AA.

The rectifier diodes are the STTH40200C 200V/2x20A dual diode in TO-254AA, and the STTH60200C dual 200V/2x30A and STTH60400 single 400V/60A diode in hermetic SMD1.

ST's new rad-hard rectifiers and Schottky diodes are guaranteed by characterization to resist a total ionizing dose (TID) up to 3 Mrad (Si). The voltage drop is guaranteed at four values of operating current to let multiple different power-supply designs use a single device type for ease and simplicity.

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Major Points in Table of Contents:

Global 3D Integrated Circuit Market Report 2020

1 3D Integrated Circuit Product Definition

2 Global 3D Integrated Circuit Market Manufacturer Share and Market Overview

2.1 Global Manufacturer 3D Integrated Circuit Shipments

2.2 Global Manufacturer 3D Integrated Circuit Business Revenue

2.3 Global 3D Integrated Circuit Market Overview

2.4 COVID-19 Impact on 3D Integrated Circuit Industry

3 Manufacturer 3D Integrated Circuit Business Introduction

3.1 Jiangsu Changjiang Electronics Technology Corporation 3D Integrated Circuit Business Introduction

3.2 Amkor Technology 3D Integrated Circuit Business Introduction

3.3 United Microelectronics Corporation 3D Integrated Circuit Business Introduction

3.4 STMicroelectronics 3D Integrated Circuit Business Introduction

3.5 Texas Instruments 3D Integrated Circuit Business Introduction

3.6 Samsung Electronics 3D Integrated Circuit Business Introduction

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