Panel Level Packaging Market 2020 Business Insights and Global Outlook - Amkor Technology, Inc., Deca Technologies, Lam Research Corporation, ASE Group

Global Panel Level Packaging Market - Growth, Trends, And Forecast (2020 - 2024)

The report presents an in-depth assessment of the Global Panel Level Packaging including enabling technologies, key trends, market drivers, challenges, standardization, regulatory landscape, deployment models, operator case studies, opportunities, future roadmap, value chain, ecosystem player profiles and strategies. The report also presents forecasts for Global Panel Level Packaging investments from 2020 till 2024.

Panel level packaging (PLP) market is anticipated to witness a CAGR of 28.0% over the forecast period 2019 - 2024.

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The Global Panel Level Packaging market is highly competitive and consists of a number of major players. Companies, like�Amkor Technology, Inc., Deca Technologies, Lam Research Corporation, ASE Group, Siliconware Precision Industries Co., Ltd., Fraunhofer Institute for Reliability and Microintegration IZM, Taiwan Semiconductor Manufacturing Company, Limited, Shinko Electric Industries Co, Ltd. among others.

Industry News:

April 2019 - Samsung Electronics acquired the panel level packaging business unit from its own Samsung Electro-Mechanics company to enhance its capability in the panel level packaging market. This is also, to regain Apple Inc.'s contract for application processor development, which has been taken by Taiwan Semiconductor Manufacturing Company, Limited (TSMC) in 2015 through commercialization of its FOWLP (Fan Out-Wafer Level Package) technology.

September 2018 - Powertech Technology Inc., announced to invest USD 1.63 billion for the development of advanced fabrication and packaging technology over the next five years. This investment is to cater to the growing demand for advanced circuit design for AI & IoT related applications.

Scope of the Report:

The scope for Panel level packaging (PLP) technology is primarily focused on recent packaging technologies like Fan-Out Wafer Level Package (FOWLP), other than the conventional technique of wafer-based packaging. Panel level packaging technology is used for packaging of various semiconductor products such as field-programmable gate array (FPGA), CPU/GPU, power management IC module, baseband, WiFi devices, RF devices, transducers, and networking & servers.

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Key Market Trends:

High Growth in Processing Technologies for Semiconductor Industry

- Semiconductor components such as memory chips, logic, analog components, micro processing unit (MPU), discrete, sensors and others have seen a surge in demand due to increased sales of the consumer as well as industrial electronics products. Sophisticated electronics components in wearable electronics and IoT based products demand fast processing of electronic devices circuits which in turn has created potential space for highly flexible ICs withstanding greater thermal resistance and physical performance.
- To cater to the need of enhanced ICs for high-end industrial applications in automotive, electronics, aerospace, telecommunication and others, level packing technology providers are moving from traditional wafer-based packaging to new packaging technologies like FOWLP.
- According to Semiconductor Industry Association (SIA), memory, logic, analog, and MPU related semiconductor products accounts for more than 80% of the total sales in the semiconductor industry; hence providing a surged opportunity for market leaders to focus on packaging process for these particular products.

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The key insights of the Panel Level Packaging Market report:

The report provides key statistics on the market status of the Panel Level Packaging market manufacturers and is a valuable source of guidance and direction for companies and individuals interested in the industry.
The report provides a basic overview of the industry including its definition, applications and manufacturing technology.
The Panel Level Packaging market report presents the company profile, product specifications, capacity, production value, and 2015-2020 market shares for key vendors.
The total market is further divided by company, by country, and by application/type for the competitive landscape analysis.
The report estimates 2020-2024 market development trends of Panel Level Packaging Market.
Analysis of upstream raw materials, downstream demand and current market dynamics is also carried out
The report makes some important proposals for a new project of Panel Level Packaging Industry before evaluating its feasibility.

Finally, Panel Level Packaging Market report is the believable source for gaining the market research that will exponentially accelerate your business. The report gives the principle locale, economic situations with the item value, benefit, limit, generation, supply, request and market development rate and figure and so on. Panel Level Packaging industry report additionally Present new task SWOT examination, speculation attainability investigation, and venture return investigation.

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