Flip Chip Market: Business Development Strategies by Major Industry Giants: IBM, Intel Corp., Fujitsu Ltd., 3M, Samsung electronics Co., Ltd., Amkor Technology, Inc., TSMC, Ltd., Apple, Texas Instruments, Inc., and AMD, Inc.

The key players in the flip chip market are focused on expanding their business operations in the emerging countries with new product launches through various research and development facilities. The major players profiled in this report include IBM, Intel Corporation, Fujitsu Ltd., 3M, Samsung electronics Co., Ltd., Amkor Technology, Inc., TSMC, Ltd., Apple, Inc., Texas Instruments, Inc., and AMD, Inc. among others.

The Flip Chip Market Report [2020-2030] contains the company profiles by Company overview, Company snapshot, Operating business segments, Business performance with Key strategic moves and developments.

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Key Benefits for Decision Makers from this Report:

o Porter's Five Forces analysis highlights the potential of buyers and suppliers as well as provides insights on the competitive structure of the market to devise effective growth strategies and facilitate better decision-making

o Value chain analysis provides key inputs on the role of stakeholders involved at various stages of the value chain

o Comprehensive analysis of the current and future trends in the global flip chip market is provided in this report

o The report offers a competitive scenario of the market along with the growth trends, structure, driving factors, scope, opportunities, and challenges

o The report includes a comprehensive analysis of the flip chip industry segments to provide insights on the market dynamics

Segment review

The market is segmented based on flip chip packaging technology, bumping technology, industry vertical, and geography.

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Flip chips majorly differ from each other on the basis of bumping technology used in them. Currently, copper bumping is extensively used in market owing to its advantages such as considerably low cost than other methods, high efficiency and compatibility with bond pads. Furthermore, impending need of circuit miniaturization, thriving portable devices industry and technological superiority over wire bond connections are major factors expected to propel the growth in global flip chip market.

2.5D IC packaging technology dominated the overall market in 2015 owing to its several advantages such as enhanced capacity, improved performance, and reduced system space requirements and low power consumption. 3D IC is expected to register highest CAGR as it is equipped with all the advantages of 2.5D IC as well as some additional advantages.

In bumping technology segment, copper bumping held over 50% in the year 2015 due to its exclusive advantages of low cost, compatibility with bond pads and applications in technologies such as transceivers, embedded processors, application processors, power management, baseband, ASICs and SOCs. However, Tin-lead eutectic solder is expected to witness low growth rate due to government initiatives to ban toxic substances that have impacted its market heavily.

Electronics industry contributed over 45% of the overall flip chip market in the year 2019. Imminent need of size reduction in electronics devices, requirement of higher data transmission speed and improvement in efficiency collectively thrust the replacement of wire bond with flip chips in electronics industry, hence making it dominant in the overall market. However, IT and telecommunication would be the fastest growing segment and is expected to register highest CAGR 12.3% during the forecast period.

Asia-pacific dominated the market in the year 2019 by accounting over 50% of the total market revenue and it is expected to maintain its dominance throughout the forecast period. This is accredited to the presence of various manufacturing facilities in the region, high consumption and production of electronic products where flip chip is steadily replacing wire bond and ongoing research and development in the region.

The exclusive advantages of flip chip such as less space consumption, better efficiency, more I/O options as well as improved heat dissipation make them apt replacement of wire bond. In addition, improved heat dissipation of ball grid array type flip chips makes them suitable choice in applications, where smaller size is available without the presence of external heat sink. With the collective effect of these factors the flip chip market is anticipated to witness a high growth in next 5-6 years.

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Key Findings of Flip Chip Market Report [2020-2030 Edition]:

o In 2019, copper pillar led the overall flip chip market revenue, and is projected to grow at a CAGR of 9.8% during the forecast period.

o Tin-lead eutectic solder is expected to witness low growth rate due to government initiatives to ban toxic substances that have impacted its market heavily.

o Electronics industry constituted significant share in the overall flip chip market in the year 2019 due to imminent need of size reduction in electronics devices, requirement of higher data transmission speed and improvement in efficiency.

o In packaging technology of flip chips, 2.5D IC packaging dominated the market in 2015.

o Asia-Pacific dominated the market in the year 2019 by accounting over 50% of the total market revenue.

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Flip Chip Market Key Segmentation:

The market is segmented on the basis of packaging technology, bumping technology, industry vertical, and geography.

By Packaging Technology

o 3D IC
o 2.5D IC
o 2D IC

By Bumping Technology

o Copper Pillar
o Solder Bumping
o Tin-lead eutectic solder
o Lead-free solder
o Gold Bumping
o Others (Aluminum & Conductive polymer)

By Industry

o Electronics
o Industrial
o Automotive & Transport
o Healthcare
o IT & Telecommunication
o Aerospace and Defense
o Others (Renewable Energy and Media & Entertainment )
By Geography
o North America

o U.S.
o Canada
o Mexico

o Europe

o Germany
o France
o Italy
o Rest of Europe

o Asia-Pacific

o China
o Japan
o Taiwan
o Korea
o India
o Rest of Asia-Pacific

o LAMEA

o Latin America
o Middle East
o Africa

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