Integrated Passive Device Market in Wireless Communication Segment is Expected to Witness High Growth Opportunities By 2025
The RF integrated passive device market will experience growth with RF lumped elements being the significant building blocks for the designing of passive circuits. The glass-based RF passives enable high-performance components for 5G, LTE, IoT connectivity, and satellite communications. The advent of 5G communication technology will support the RF passives industry. RF front end designers require passive devices that serve in several functional blocks in their radio designs.
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Silicon-based devices in the integrated passive device market are expected to witness a high demand owing to the advantages offered by the integration of silicon with passives. Silicon forms a stable base substrate that features a very small thermal coefficient expansion mismatch with the connected ICs. The material provides necessary insulation, ensuring smooth performance of devices. The integration of silicon with passive yields will benefit from wireless designs.
Automotive manufacturers are increasingly incorporating the latest advanced technologies such as AI, IoT, and remote device tracking. Integrated devices form the base of these advanced technologies. Ultra-miniaturized low-cost RF passives are being deployed for applications in the automotive sector. The demand for filter components and advanced capacitors that deliver the required miniaturization and integration in robust vehicle environments will favor the integrated passive device market growth.
The high cost of these devices is a key factor hampering the integrated passive device market growth. The growing electronics sector is demanding a high scale integration of these devices, increasing the overall manufacturing cost. Moreover, the increasing complexity of these devices is posing several technical challenges for manufacturers. The difficulty in modifying an integrated circuit after its fabrication is also a significant factor hindering the market growth. The high cost of these devices in conventional packaging restricting their widespread adoption will impact the industry growth.
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The integrated passive device market is anticipated to witness strong growth in Asia Pacific owing to the booming electronics and communication sector in several countries including China, India, and Japan. The improving standard of living in countries including India coupled with the rising disposable incomes is expected to surge the demand for high-performance passives. Increasing investments in the technical sector in several countries in Europe will boost the market in the region.
Major players operating in the integrated passive device market include STATS ChipPAC Ltd, Texas Instruments Inc., Micron Technology Inc., STMicroelectronics, 3DiS Technologies, NXP Semiconductors, On Semiconductor Corporation, Johanson Technology, Inc., Murata Manufacturing Co., Ltd., and Taiwan Semiconductor Manufacturing Company Limited. The industry is characterized by huge investments in R&D for launching new solutions.
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