Press release
Underfill Adhesives Market Size, Share, Development by 2025
The underfill adhesive is a kind of chemical glue (the main component is epoxy resin) to fill the bottom of the BGA packaging mode chip, using the curing form of heating, the BGA bottom void area (general cover general cover more than 80%) to fill, so as to achieve the purpose of reinforcement.
Global Underfill Adhesives market size will increase to xx Million US$ by 2025, from xx Million US$ in 2018, at a CAGR of xx% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Underfill Adhesives.
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This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
This report focuses on the Underfill Adhesives in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa.
Market Segment by Manufacturers, this report covers
Panacol
Buhnen
Henkel
Epoxy International
Lord Corporation
Panasonic
Master Bond
AI Technology
Darbond Technology
Market Segment by Type, covers
Single Component Underfill Adhesives
Two-Component Underfill Adhesives
Market Segment by Applications, can be divided into
Ball Grid Arrays
Chip Scale Packaging
Land Grid Arrays
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Related Information:
North America Underfill Adhesives Market Research Report 2019
United States Underfill Adhesives Market Research Report 2019
Asia-Pacific Underfill Adhesives Market Research Report 2019
Europe Underfill Adhesives Market Market Research Report 2019
EMEA Underfill Adhesives Market Market Research Report 2019
Global Underfill Adhesives Market Market Research Report 2019
China Underfill Adhesives Market Market Research Report 2019
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