Press release
Redistribution Layer Material Market to 2027 - Global Analysis and Forecasts by Material (Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others); Application (FOWLP and 2.5D/3D IC Packaging)
Redistribution Layer Material Market
Get Sample PDF Copy of Redistribution Layer Material Market Report: http://bit.ly/2OfTB6k
Top Manufactures of Redistribution Layer Material Market: –
Advanced Semiconductor Engineering, Inc. (ASE group)
Amkor Technology, Inc.
Fujifilm Holdings Corporation
Hitachi Chemical DuPont MicroSystems L.L.C.
Infineon Technologies AG
Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET)
NXP Semiconductors N.V.
Samsung Electronics Co. Ltd
Shin-Etsu Chemical Co., Ltd.
SK HYNIX INC.
Sumitomo Bakelite Co., Ltd
The Dow Chemical Company
Toray Industries, Inc.
Taiwan Semiconductor Manufacturing Company Ltd.
Material Insights
The global redistribution layer material market by material was led by polyimide segment. The other materials for redistribution layer material market include FEpoxy (phenol & acrylates based), metal and Silicones. A polymer material is required for redistribution layer in the advanced packaging techniques that catalyzes in routing the connection between the solder bumps and the I/O pads. The materials used for redistribution are used as passivation layer for bumping and stress buffers. There are a certain set of physical characteristics required in the dielectric material used for RDL in the advanced packaging applications that include low cure temperature, low dielectric constant, higher chemical and mechanical stabilities.
Application Insights
The redistribution layer material market by end use is segmented into Fan-Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging. Advanced packaging techniques integrate multiple die in a single package and thereby ensure in reducing the device footprint. Also, integrating multiple-die in a single package ensures, multiple functionalities of the device in a small form factor. The majorly used advanced packaging techniques have been broadly categorized under two segments namely Fan-out Wafer Level Packaging (FOWLP) and 2.5D/3D IC packaging. Redistribution layers find their applications in these advanced level packaging where they are placed for resolving issues related to heat dissipation, elongation of battery life, and enhancement of the performance.
The reports cover key developments in the Redistribution Layer Material market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for expansion of business and customer base of market players. The market payers from Redistribution Layer Material market are anticipated to lucrative growth opportunities in the future with the rising demand for Redistribution Layer Material in the global market.
The report analyzes factors affecting Redistribution Layer Material market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA and South & Central America after evaluating political, economic, social and technological factors effecting the Redistribution Layer Material market in these regions.
Table of Contents included in Redistribution Layer Material Market Report –
Introduction
Key Takeways
Research Methodology
Redistribution Layer Material Market Landscape
Redistribution Layer Material Market - Key Market Dynamics
Redistribution Layer Material Market - Global Market Analysis
Redistribution Layer Material Market - Revenue And Forecasts To 2027 - Product Type
Redistribution Layer Material Market - Revenue And Forecasts To 2027 - Industry
Industry Landscape
Redistribution Layer Material Market, Key Company Profiles
Appendix
Purchase Report at: http://bit.ly/2OpWJwe
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