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Redistribution Layer Material Market Report by Growth Drivers, Challenges, and Investment Opportunities – Forecast 2027

07-26-2019 12:30 PM CET | Business, Economy, Finances, Banking & Insurance

Press release from: The Insight Partners

/ PR Agency: The Insight Partners
Redistribution Layer Material Market

Redistribution Layer Material Market

APAC was the leading geographic market and it is anticipated to be the highest revenue contributor throughout the forecast period. The presence of large semiconductor manufacturing industry in the countries like South Korea, China, Taiwan, and Japan, is expected to fuel growth of redistribution layer material market in this region.

The global redistribution layer material market accounted to US$ 105.4 Mn in 2018 and is expected to grow at a CAGR of 25.7% during the forecast period 2019 - 2027, to account to US$ 794.5 Mn by 2027.

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Strategic Insights

The market players present in redistribution layer material market are mainly focusing towards product enhancements by implementing advance technologies. By signing partnership, contracts, joint ventures, funding, and inaugurating new offices across the world permit the company maintain its brand name globally. Most of the market initiative were observed in Asia Pacific, North America, Europe regions, which have high density of semiconductor manufacturing industries. Few of the recent developments are listed below:

2018: Sumitomo Bakelite Co., Ltd. and Sumitomo Dainippon Pharma Co., Ltd. together announced the establishment of a new joint company, SB Bioscience Co., Ltd. By combining the know-how of in-vitro diagnostics of DS Pharma Biomedical Co., Ltd. and the technologies of Sumitomo Bakelite Co., Ltd., both the companies focus to accelerate new diagnostics development and make a further contribution to the society.

2018: ASE Group unveiled its plan to build K25 Factory Building in Kaohsiung. The K25 building will be ASE’s state of the art facility with an intelligent manufacturing processes, high degree of automation, and smart logistics.

2018: Advanced Semiconductor Engineering, Inc. collaborated with Cadence Design Systems, Inc. to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages. This solution handles heterogeneous and homogeneous chip integration with high-density packaging to enhance the efficiency of chip and passive design optimization.

GLOBAL REDISTRIBUTION LAYER MATERIAL – MARKET SEGMENTATION

By Material

Polyimide (PI)
Polybenzoxazole (PBO)
Benzocylobutene (BCB)
Others

By Application

FOWLP
2.5D/3D IC Packaging
By 2.5D/3D IC Packaging

High Bandwidth Memory (HBM)
Multi-Chip Integration
Package on Package (FOPOP)
Others

By Geography

North America
U.S.
Rest of North America
Europe
Germany
UK
Portugal
Rest of Europe
Asia Pacific (APAC)
South Korea
China
Taiwan
Japan
Rest of APAC
Rest of World (RoW)
Company Profiles

Advanced Semiconductor Engineering, Inc. (ASE group)
Amkor Technology, Inc.
Fujifilm Holdings Corporation
Hitachi Chemical DuPont MicroSystems L.L.C.
Infineon Technologies AG
Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET)
NXP Semiconductors N.V.
Samsung Electronics Co. Ltd
Shin-Etsu Chemical Co., Ltd.
SK HYNIX INC.
Sumitomo Bakelite Co., Ltd
The Dow Chemical Company
Toray Industries, Inc.
Taiwan Semiconductor Manufacturing Company Ltd.

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Call: +1-646-491-9876
Email: sales@theinsightpartners.com

The Insight Partners is a one stop industry research provider of actionable intelligence. We help our clients in getting solutions to their research requirements through our syndicated and consulting research services. We are a specialist in Technology, Healthcare, Manufacturing, Automotive and Defense.

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