Press release
Redistribution Layer Material Market to grow at a CAGR of 25.7% Globally 2027 : ASE group, Amkor Technology, Fujifilm Holdings Corporation, Infineon Technologies, JCET, NXP Semiconductors
Redistribution Layer Material Market
APAC was the leading geographic market and it is anticipated to be the highest revenue contributor throughout the forecast period. The presence of large semiconductor manufacturing industry in the countries like South Korea, China, Taiwan, and Japan, is expected to fuel growth of redistribution layer material market in this region.
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The List of Companies
• Advanced Semiconductor Engineering, Inc. (ASE group)
• Amkor Technology, Inc.
• Fujifilm Holdings Corporation
• Hitachi Chemical DuPont MicroSystems L.L.C.
• Infineon Technologies AG
• Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET)
• NXP Semiconductors N.V.
• Samsung Electronics Co. Ltd
• Shin-Etsu Chemical Co., Ltd.
• SK HYNIX INC.
• Sumitomo Bakelite Co., Ltd
• The Dow Chemical Company
• Toray Industries, Inc.
• Taiwan Semiconductor Manufacturing Company Ltd.
The redistribution layer material market by end use is segmented into Fan-Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging. Advanced packaging techniques integrate multiple die in a single package and thereby ensure in reducing the device footprint. Also, integrating multiple-die in a single package ensures, multiple functionalities of the device in a small form factor. The majorly used advanced packaging techniques have been broadly categorized under two segments namely Fan-out Wafer Level Packaging (FOWLP) and 2.5D/3D IC packaging. Redistribution layers find their applications in these advanced level packaging where they are placed for resolving issues related to heat dissipation, elongation of battery life, and enhancement of the performance.
The global redistribution layer material market by material was led by polyimide segment. The other materials for redistribution layer material market include FEpoxy (phenol & acrylates based), metal and Silicones. A polymer material is required for redistribution layer in the advanced packaging techniques that catalyzes in routing the connection between the solder bumps and the I/O pads. The materials used for redistribution are used as passivation layer for bumping and stress buffers. There are a certain set of physical characteristics required in the dielectric material used for RDL in the advanced packaging applications that include low cure temperature, low dielectric constant, higher chemical and mechanical stabilities.
Reasons To Buy:
• Highlights key business priorities in order to assist companies to realign their business strategies.
• The key findings and recommendations highlight crucial progressive industry trends in the redistribution layer material market, thereby allowing players to develop effective long term strategies.
• Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
• Scrutinize in-depth global market trends and outlook coupled with the factors driving the market, as well as those hindering it.
• Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to products, segmentation and industry verticals.
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The Insight Partners is a one stop industry research provider of actionable intelligence. We help our clients in getting solutions to their research requirements through our syndicated and consulting research services. We are a specialist in Technology, Healthcare, Manufacturing, Automotive and Defense.
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