Press release
Redistribution Layer Material Market to grow at a CAGR of 25.7% Globally 2027 : ASE group, Amkor Technology, Fujifilm Holdings Corporation, Infineon Technologies, JCET, NXP Semiconductors
Redistribution Layer Material Market
APAC was the leading geographic market and it is anticipated to be the highest revenue contributor throughout the forecast period. The presence of large semiconductor manufacturing industry in the countries like South Korea, China, Taiwan, and Japan, is expected to fuel growth of redistribution layer material market in this region.
Get Sample PDF Copy at: http://bit.ly/2ZPHYE3
The List of Companies
• Advanced Semiconductor Engineering, Inc. (ASE group)
• Amkor Technology, Inc.
• Fujifilm Holdings Corporation
• Hitachi Chemical DuPont MicroSystems L.L.C.
• Infineon Technologies AG
• Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET)
• NXP Semiconductors N.V.
• Samsung Electronics Co. Ltd
• Shin-Etsu Chemical Co., Ltd.
• SK HYNIX INC.
• Sumitomo Bakelite Co., Ltd
• The Dow Chemical Company
• Toray Industries, Inc.
• Taiwan Semiconductor Manufacturing Company Ltd.
The redistribution layer material market by end use is segmented into Fan-Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging. Advanced packaging techniques integrate multiple die in a single package and thereby ensure in reducing the device footprint. Also, integrating multiple-die in a single package ensures, multiple functionalities of the device in a small form factor. The majorly used advanced packaging techniques have been broadly categorized under two segments namely Fan-out Wafer Level Packaging (FOWLP) and 2.5D/3D IC packaging. Redistribution layers find their applications in these advanced level packaging where they are placed for resolving issues related to heat dissipation, elongation of battery life, and enhancement of the performance.
The global redistribution layer material market by material was led by polyimide segment. The other materials for redistribution layer material market include FEpoxy (phenol & acrylates based), metal and Silicones. A polymer material is required for redistribution layer in the advanced packaging techniques that catalyzes in routing the connection between the solder bumps and the I/O pads. The materials used for redistribution are used as passivation layer for bumping and stress buffers. There are a certain set of physical characteristics required in the dielectric material used for RDL in the advanced packaging applications that include low cure temperature, low dielectric constant, higher chemical and mechanical stabilities.
Reasons To Buy:
• Highlights key business priorities in order to assist companies to realign their business strategies.
• The key findings and recommendations highlight crucial progressive industry trends in the redistribution layer material market, thereby allowing players to develop effective long term strategies.
• Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
• Scrutinize in-depth global market trends and outlook coupled with the factors driving the market, as well as those hindering it.
• Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to products, segmentation and industry verticals.
Get Discount on This Report at: http://bit.ly/2ZZrnOh
Contact Us:
Call: +1-646-491-9876
Email: sales@theinsightpartners.com
Website: https://www.theinsightpartners.com/
About Us:
The Insight Partners is a one stop industry research provider of actionable intelligence. We help our clients in getting solutions to their research requirements through our syndicated and consulting research services. We are a specialist in Technology, Healthcare, Manufacturing, Automotive and Defense.
This release was published on openPR.
Permanent link to this press release:
Copy
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.
You can edit or delete your press release Redistribution Layer Material Market to grow at a CAGR of 25.7% Globally 2027 : ASE group, Amkor Technology, Fujifilm Holdings Corporation, Infineon Technologies, JCET, NXP Semiconductors here
News-ID: 1791202 • Views: …
More Releases from The Insight Partners
Agricultural Lighting Market Estimated to Experience a Hike in Growth by 2031
The increasing adoption of indoor farming practices is a significant driver of the agricultural lighting market. As urbanization rises and arable land decreases, farmers are turning to controlled environment agriculture (CEA) to maximize yield. Advanced lighting solutions, such as LED grow lights, provide the necessary light spectrum for optimal plant growth, enabling year-round production. This shift towards indoor and vertical farming systems drives the demand for effective and energy-efficient agricultural…
Medical Device Validation and Verification Market Worth by 2031
Offers a comprehensive overview of the market's current state and future growth trajectory. It identifies key drivers, challenges, and opportunities, providing valuable insights for various business stakeholders. According to the report's forecast, the sector is set to witness a steady expansion in market size, market share, and innovation over the next six years.
Download Sample PDF @ https://www.theinsightpartners.com/sample/TIPRE00016735/?utm_source=OpenPR&utm_medium=10759
Key Growth Drivers
The press release details five major factors propelling the market forward:
1. Stringent…
Medical Vacuum Filters Market Positioned for Substantial Growth Through 2031
New York, US - August 28, 2025- A new market report from The Insight Partners projects a strong and steady expansion for the global medical vacuum filters market, fueled by a confluence of rising healthcare demands and technological innovation. The report, titled "Medical Vacuum Filters Market Share, Size, Trends, and Forecast by 2031," highlights that the sector is set for significant growth in both market size and innovation over the…
Growing Industrial Automation and IoT Driving the Level Translators Market
New York, US - August 21, 2025- The market for level translators is projected to grow significantly by 2031, fueled by the rise in industrial automation and the expanding use of consumer electronics, automotive systems, and IoT devices. According to a new report from The Insight Partners, this growth is driven by the increasing need for components that can seamlessly bridge the gap between devices operating at different voltage…
More Releases for Redistribution
Redistribution Layer Material Market Vendor Analysis, Business Growth, Global Sc …
The redistribution layer acts as a crucial step in the advanced wafer packaging. RDL serves as a rerouting of the I/O layout and allows a higher I/O number. A high I/O density usually creates better electrical performance, as more outputs result in faster electrical signals between the die and minimize the risk posed by electrical shorts. Besides, a higher I/O density enables the package to achieve better performance simultaneously.
Sample PDF…
Redistribution Layer Material Market Key Development, Opportunity, Application & …
The research study provided by Stratagem Market Insights on Redistribution Layer Material Market offers a strategic assessment of the market. The industry report focuses on the growth opportunities, which will help the Redistribution Layer Material Market to expand operations in the existing markets.
Next, in this report, you will locate the aggressive situation of the significant market players concentrating on their business income, client requests, organization profile, import/trade situation, business procedures…
Redistribution Layer Material Market Share, Demand Analysis, Growth, Trends and …
The global redistribution layer material market accounted for US$ 105.4 Mn in 2018 and is expected to grow at a CAGR of 25% over the forecast period 2021-2027, to account for US$ 794.5 Mn by 2027.
The demand for redistribution layer materials is heavily driven by growing applications in consumer electronics, data centers, IoT sensors and communication devices worldwide. The growing number of consumer electronic devices and the rapid adoption of…
Key Vendor Analysis for Global Copper Redistribution Layer Market till 2020-2025
Coronavirus-Covid 2019 has a significant impact on the global market economy, so it is important to find a correct strategy to deal with it. Our analysis team will track key datasets including Revised Vendor Landscape Mix, Revenue Impact analysis, New opportunities mapping, Disruptions and New opportunities in the Supply Chain etc.
The research report published by GLOBAL INFO RESEARCH is a comprehensive study of the global Copper Redistribution Layer market. The subject matter experts…
Redistribution Layer Material Market to Witness Surge in Demand Owing to Rising …
"The global redistribution layer material market accounted to US$ 105.4 Mn in 2018 and is expected to grow at a CAGR of 25.7% during the forecast period 2020 - 2027, to account to US$ 794.5 Mn by 2027." APAC was the leading geographic market and it is anticipated to be the highest revenue contributor throughout the forecast period. The presence of large semiconductor manufacturing industry in the countries like South…
Redistribution Layer Material Market Report by Growth Drivers, Challenges, and I …
APAC was the leading geographic market and it is anticipated to be the highest revenue contributor throughout the forecast period. The presence of large semiconductor manufacturing industry in the countries like South Korea, China, Taiwan, and Japan, is expected to fuel growth of redistribution layer material market in this region.
The global redistribution layer material market accounted to US$ 105.4 Mn in 2018 and is expected to grow at a…
