03-15-2019 09:34 PM CET - Industry, Real Estate & Construction

6% CAGR growth by 2023 in the Thin Wafer Processing and Dicing Equipment Market| Major Vendors - SUZHOU DELPHI LASER CO., LTD, SPTS TECHNOLOGIES LIMITED (ORBOTECH), PLASMA-THERM LLC, HAN'S LASER TECHNOLOGY CO. LTD, amongst others

Press release from: Market Prognosis

Market Analysis:

Asia Pacific is growing at A Faster Pace
Asia Pacific is the fastest growing semiconductor market in the world. Growing initiatives like Make in India by the Indian government and Vision 2020 by the Chinese government are increasingly drawing attention from the international players to set up local production establishments.

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Integration of microelectronics into several consumer electronics and smart cards needed for thinner wafers are increasing rapidly. Technologies like RFID, MEMS Devices, and power devices are considered to be the major source of demand for these thin wafers. Applications of the RFID technology is expected to create more demand for thinner wafers driving positive growth for processing and dicing equipment over the forecast period. This scenario is increasingly creating demand for better manufacturing process, especially processing and dicing which are important phases of ultra-thin wafer production. Many new processes such as chemical mechanical polishing (CMP) are increasingly being integrated into the processing phase along with grinding operations to ensure smoothly polished wafer surface.

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Market Segments:
Thin Wafer Processing and Dicing Equipment Market is segmented by:
1. Equipment Type: Thinning Equipment, Dicing Equipment
2. Equipment Technology: Thinning Equipment (Grinding, Grinding + CPM, Wet/Dry Etching, TAIKO), Dicing Equipment (Blade Dicing, Laser Ablation, Stealth Dicing, Plasma Dicing)
3. Application: Memory and Logic (TSV), MEMS Devices, Power Devices, CMOS Image Sensors, RFID
4. Geography: North America, South America, Europe, Asia Pacific, Middle East & Africa

Key Developments in the Market
• February 2018 - SPTS Technologies received approximately USD 37 million in orders for multiple etch and deposition systems from two GaAs foundry customers. SPTS’s Omega plasma etch, Delta PECVD, and Sigma PVD are expected to be installed in these foundries to manufacture radio frequency (RF) devices for 4G and emerging 5G wireless infrastructure.

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