Press release
Global Underfill Market Emerging Trends and Prospects by leading PlayersHenkel, WON CHEMICAL, NAMICS, SUNSTAR, Hitachi Chemical, Fuji.
This report studies the Underfill market, Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.Download Free Report Sample (PDF) Here:https://www.researchreporthub.com/report/global-underfill-market/44364/#requestforsample
Scope of the Report:
The competition in the underfill industry is intense. There are thousands of manufacturers in this industry. Major manufacturers include Henkel, WON CHEMICAL, Namics, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond etc. The competition status wouldnt change in the short term. The growth of underfill industry depends on the growth of household appliances, computers and consumer electronics.
In China, the high-end underfill products mainly rely on import from foreign developed countries, like US, Germany, Japan. To meet the large demand for the high-end products, Chinese manufacturers will invest much more on the R&D, which will certainly weaken the dependence of imports.
The worldwide market for Underfill is expected to grow at a CAGR of roughly 3.4% over the next five years, will reach 470 million US$ in 2024, from 380 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Underfill in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
Henkel
WON CHEMICAL
NAMICS
SUNSTAR
Hitachi Chemical
Fuji
Shin-Etsu Chemical
Bondline
AIM Solder
Zymet
Panacol-Elosol
Master Bond
DOVER
Darbond
HIGHTITE
U-bond
......
Get Discount & Customization of this Report Here:https://www.researchreporthub.com/report/global-underfill-market/44364/
1 Market Overview
1.1 Underfill Introduction
1.2 Market Analysis by Type
1.2.1 Semiconductor Underfills
1.2.2 Board Level Underfills
1.3 Market Analysis by Applications
1.3.1 Industrial Electronics
1.3.2 Defense & Aerospace Electronics
1.3.3 Consumer Electronics
1.3.4 Automotive Electronics
1.3.5 Medical Electronics
1.3.6 Others
1.4 Market Analysis by Regions
1.4.1 North America (United States, Canada and Mexico)
1.4.1.1 United States Market States and Outlook (2014-2024)
1.4.1.2 Canada Market States and Outlook (2014-2024)
1.4.1.3 Mexico Market States and Outlook (2014-2024)
1.4.2 Europe (Germany, France, UK, Russia and Italy)
1.4.2.1 Germany Market States and Outlook (2014-2024)
1.4.2.2 France Market States and Outlook (2014-2024)
1.4.2.3 UK Market States and Outlook (2014-2024)
1.4.2.4 Russia Market States and Outlook (2014-2024)
1.4.2.5 Italy Market States and Outlook (2014-2024)
1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
1.4.3.1 China Market States and Outlook (2014-2024)
1.4.3.2 Japan Market States and Outlook (2014-2024)
1.4.3.3 Korea Market States and Outlook (2014-2024)
1.4.3.4 India Market States and Outlook (2014-2024)
1.4.3.5 Southeast Asia Market States and Outlook (2014-2024)
1.4.4 South America, Middle East and Africa
1.4.4.1 Brazil Market States and Outlook (2014-2024)
1.4.4.2 Egypt Market States and Outlook (2014-2024)
1.4.4.3 Saudi Arabia Market States and Outlook (2014-2024)
1.4.4.4 South Africa Market States and Outlook (2014-2024)
1.4.4.5 Turkey Market States and Outlook (2014-2024)
1.5 Market Dynamics
1.5.1 Market Opportunities
1.5.2 Market Risk
1.5.3 Market Driving Force
2 Manufacturers Profiles
2.1 Henkel
2.1.1 Business Overview
2.1.2 Underfill Type and Applications
2.1.2.1 Product A
2.1.2.2 Product B
…..
Get Complete TOC with Figures and Tables Here:https://www.researchreporthub.com/report/global-underfill-market/44364/#toc
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