Hybrid Memory Cube and High-Bandwidth Memory Market Growth And Global Analysis By IBM, Micron Technology, Samsung, SK Hynix, Advanced Micro Devices, Intel, Xilinx, Fujitsu, Nvidia, Open-Silicon

Market Insights:

Market Research Future's latest report on the global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market estimates growth at a highly promising CAGR of 35% during the forecast period of 2017 to 2023. HMC & HBM are RAM interfaces of which HMC devices use a separate processor to increase memory capacity, while HBM uses a graphical processing unit in the same package to provide tightly-coupled high speed. The increasing demand for HMC & HBM is driven primarily by its applications which are expected to lead the market to an estimated market value of USD 3.7 Bn.

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Hybrid memory cube and high bandwidth memory devices have applications in data centers, smartphones, & high-end computation devices. The technology is backed by tech giants in the industry due to the potential it has. HBM was developed to counter the issue of increasing power usage and to deliver high performance, scalability and power efficiency. HBM has applications in graphics and computing. Meanwhile, HMC was developed for applications in high-end servers, and this technology offers a high bandwidth, power efficiency, scalability, versatility on different platforms and a reduced physical footprint. the various features associated with HMC and HBM act as key drivers of market growth. Additionally, Advancements in technology has yielded high performance end-user devices and led to an increased demand for high performance across the board in IT & technology. As a result, the demand for HBM & HMC has grown significantly to provide the market with exponential growth over the forecast period.

Market Segmentation:

The global hybrid memory cube and high bandwidth memory market are segmented into memory type, product type, application, and region. By memory type, the market is divided between hybrid memory cube (HMC) and high-bandwidth memory (HBM). By product type, the market includes field programmable gate array (FPGA), central processing unit (CPU), application-specific integrated circuit, graphics processing unit (GPU), and accelerated processing unit. Hybrid memory cube and high bandwidth memory devices have application in high performance computing (HPC), data centers, networking & telecommunications, consumer electronics, and others.

Key Players:

Arira, SK Hynix Inc., Open-Silicon, Micron Technology, Inc., Fujitsu Ltd., Rambus Inc., Arm Holdings, Intel Corporation, Cadence Design Systems, Inc., Cray Inc., IBM Corporation, Advanced Micro Devices, Inc., Xilinx, Inc., Samsung Group, Nvidia Corporation, Marvell Technology Group, Ltd., and Taiwan Semiconductor Manufacturing Company, Ltd. are among market players of note who have been included in MRFR's competitive analysis.

Regional Analysis:

The global hybrid memory cube and high bandwidth memory market are led by the North American region due to the high number of data centers in the region and the applications of HMC and HBM in the same. Moreover, the region has high adoption of advanced technology, and as such, there is a high demand for high performance computing. The U.S is the most significant region in the market due to the high concentration of market players. The region is also flush with start-ups who contribute significantly to the advancement of the technology and by extension, the market.

The Asia Pacific market is expected to display the highest CAGR during the forecast period. The rapid growth and steady adoption of highly advanced technology combined with the presence of an electronic manufacturing hub are expected to contribute to the region's growth.

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Latest Industry News:

AMD has launched its "dual-Vega Radeon Pro V340" which is a high-performance card that includes the second generation of ECC and HBM.

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This release was published on openPR.