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What is High-Power Pulsed Magnetron Sputtering (HPPMS)?

09-06-2018 09:51 AM CET | Science & Education

Press release from: Stanford Advanced Materials

Stanford Advanced Materials

Stanford Advanced Materials

Magnetron sputtering technology is widely used in the field of thin film preparation. However, the conventional magnetron sputtering technology has a relatively low metal ionization rate. In order to increase the ionization rate of metal particles, several physical vapor deposition techniques have been developed in recent decades, including inductively coupled plasma magnetron sputtering (ICP-MS), electron cyclotron resonance magnetron sputtering (ECR-MS), hollow Cathodic magnetron sputtering (HCMS), self-sustained magnetron sputtering (SSS) and high-power pulsed magnetron sputtering (HPPMS). Among them, HPPMS has received extensive attention in recent years due to its high metal ionization rate.

High-Power pulsed Magnetron Sputtering (HPPMS) is used for the physical vapor deposition of thin film coatings based upon Magnetron Sputtering with a high voltage pulsed power source. HPPMS uses high-voltage, short-duration burst of energy focused on the target coating material to produce high-density plasma, resulting in high ionization of the target material in the plasma.

Compared with conventional sputtering technologies, the main advantages of HPPMS is the control of a high voltage pulsed power source that ionizes a very high percentage of the target material without overheating, creating a dense plasma cloud with virtually no droplets. Coatings produced by HPPMS have good adhesion and are extremely smooth. Apart from it, HPPMS can be used on substrates that are more temperature sensitive.

Of course, HPPMS also has two main disadvantages. On one hand, it requires more energy for equivalent deposition rates than conventional magnetron sputtering; on the other hand, it may cause arcing on the cathode or target surface.

HPPMS is becoming the coating technology of choice for many researchers and cutting-edge developers because HPPMS produces smoother, harder and denser coatings than traditional coating techniques. Luckily, most existing magnetron sputtering systems can be adapted to HPPMS by modifying the power source promises to make it an economical solution for advanced thin film growth control and applications in the future.

Stanford Advanced Materials (SAM) Corporation is a global evaporation material and sputtering target manufacturing company. We provide metals, alloys, oxides and ceramic materials of high quality and at a competitive price. And we regularly update industrial knowledge and news on our website. If you are interested, please visit our website for more information.

Stanford Advanced Materials (SAM) Corporation is a global evaporation material and sputtering target manufacturing company. We provide metals, alloys, oxides and ceramic materials of high quality and at a competitive price.

23661 Birtcher Dr., Lake Forest, California, USA

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