Flip Chip Technology Market - Popularity of Compact Electronics Set to Boots Market Further

Flip chips or controlled collapse chip connection (C4), used for interconnecting semiconductor devices with external circuitry while utilizing deposited solder bumps onto the chip pads, steal a march over the traditional wire bonds for many reasons. First, they have better electrical and thermal performance. Second, they have lessened form factors. And third, they have well defined substrate flexibility for different performance requirements and the maximum I/O capability.

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The electronics industry has been majorly fuelling demand in the global flip chip market. Flip chip technologies have been extensively used for making of processors of mainframe computers, smartphones, personal computers, notebooks, and tablets. They are also used for making the memories of data storage devices, application specific integrated circuits (ASICs) and telecommunications.

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Lately, due to the requirements of shrinking the chips’ area and higher functionalities of the chips, the pitch of processors decreases and the number of pin-outs of the ASCIs ,processors and memories increases.

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With the surge in popularity of compact and effective electronic products, which need circuit miniaturization, the market is set to receive further boost. The requirement for greater transmission of data will also likely fillip the market. All these will see increasing usage of flip chips in place of the conventional wire bonds.

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