Back End of the Line Semiconductor Equipment Market - Increasing Demand for Advanced Packaging Technologies Growing Market Value

Back End of Line Semi-Conductor Equipment is the second part of semiconductor devices where single devices such as capacitors, transistors and resistors, among others are interconnected by wires on wafer which are made by pure silicon and metal layers to form required electrical circuits. Common metal that forms layers are aluminum interconnect and copper interconnect. Back end of the line in semiconductor equipments is started when the wafer gets deposited by the first layer of metal.

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Major drivers driving the global back end of the line semi conductor equipments includes increasing demand for advanced packaging technologies and flip chips. With rising use of smart packaging technologies use of the same has also increased among consumers.

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In addition, increasing technological functionalities in mobile devices is a major driver driving the global back end of the line semi conductor equipments market. Increase in the number of advanced consumer electronic equipments is also a major driver driving the global market.

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Major restraints faced by the global back end of line semi conductor equipment market includes availability of few vendors in the global market which makes availability of the equipments a challenge and also increases cost

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