Flip Chip Market to Garner $46 Billion, Globally, by 2022

The global flip chip market size is expected to reach $46 billion by 2022, registering a CAGR of 9% during the forecast period 2016‐2022.

The flip chip market is majorly driven by the imminent need of circuit miniaturization, growth in internet of things (IoT), and technological superiority over wire bonding. However, the major restraints associated with the flip chip industry include the huge initial investment required for setting up new manufacturing facility and less available options for customization. Moreover, growth in demand of sensors in smartphone industry and increase in application in personal electronic devices, such as personal computers and mobiles, opens new opportunities in the flip chip market.

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The exclusive advantages of flip chip such as less space consumption, better efficiency, more I/O options as well as improved heat dissipation make them apt replacement of wire bond. In addition, improved heat dissipation of ball grid array type flip chips makes them suitable choice in applications, where smaller size is available without the presence of external heat sink. With the collective effect of these factors the flip chip market is anticipated to witness a high growth in next 5-6 years.

In bumping technology segment, copper bumping held over 50% in the year 2015 due to its exclusive advantages of low cost, compatibility with bond pads and applications in technologies such as transceivers, embedded processors, application processors, power management, baseband, ASICs and SOCs. However, Tin-lead eutectic solder is expected to witness low growth rate due to government initiatives to ban toxic substances that have impacted its market heavily.

Electronics industry contributed over 45% of the overall flip chip market in the year 2015. Imminent need of size reduction in electronics devices, requirement of higher data transmission speed and improvement in efficiency collectively thrust the replacement of wire bond with flip chips in electronics industry, hence making it dominant in the overall market. However, IT and telecommunication would be the fastest growing segment and is expected to register highest CAGR 12.3% during the forecast period. This is due to the increasing reach of telecommunication services in remote areas as well as introduction of new players in IT industry where flip chips are used in large scale in servers, host systems and data centers.

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Asia-pacific dominated the market in the year 2015 by accounting over 50% of the total market revenue and it is expected to maintain its dominance throughout the forecast period. This is accredited to the presence of various manufacturing facilities in the region, high consumption and production of electronic products where flip chip is steadily replacing wire bond and ongoing research and development in the region.

The key players in the flip chip market are focused on expanding their business operations in the emerging countries with new product launches through various research and development facilities. The major players profiled in this report include IBM, Intel Corporation, Fujitsu Ltd., 3M, Samsung electronics Co., Ltd., Amkor Technology, Inc., TSMC, Ltd., Apple, Inc., Texas Instruments, Inc., and AMD, Inc. among others.

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