Global Bonding Wire Packaging Material Market Professional Survey Report 2018

This report studies the global Bonding Wire Packaging Material market status and forecast, categorizes the global Bonding Wire Packaging Material market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, India, Southeast Asia and other regions (Central & South America, and Middle East & Africa).

Bonding wires can be made up of gold, copper, silver, and aluminum. The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for high-powered applications. Bonding wires made of gold dominated the bonding wire packaging material market for decades.

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One of the primary growth drivers for this market is the increased need for miniaturization, especially in the semiconductor industry. Bonding wires are an important part of assemblies, and metals like copper, aluminum, gold, and palladium are extensively used to produce bonding wires. In this market, the vendors need to constantly upgrade their offerings with more advanced and compact packaging materials as it will help them to cater to the consumer’s requirements. The demand for bonding wires has increased significantly owing to the growing need for miniaturization to meet the packaging requirements of the semiconductor industry.

An important trend that is spurring market growth is the extensive use of silver as an alternative material. Since the semiconductor industry is under constant pressure to introduce low-cost alternatives to gold without compromising on the quality, the use of silver as a bonding wire has been gaining traction during the forecast period.

The global market for Bonding Wire Packaging Material was dominated by APAC and it accounted for a significant share of the total market. This dominance of APAC is the likely result of the presence of several semiconductor manufacturing giants in this part of the world. Moreover, factors such as the use of alternative materials for packaging and technological advancements will play a crucial role in the growth of this region during the forecasted period.

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The major manufacturers covered in this report

Alpha Packaging
APEX Plastics
Amcor
TANAKA Precious Metals
Heraeus Deutschland
California Fine Wire
MK Electron
AMETEK
EMMTECH
Inseto
Palomar Technologies
Sumitomo Metal Mining
Tatsuta Electric Wire & Cable

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Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering
North America
Europe
China
Japan
India
Southeast Asia
Other regions (Central & South America, Middle East & Africa)

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AlgoroReports is a part of Algororesearch Consultant Pvt. Ltd. AlgoroReports is one of the largest collections of market research reports from numerous publishers with the team of industries specialist that meet with best client requirements. Market Research is based on a research project that may also be an expansion on past work in the field. Research projects can be used to develop further knowledge on a topic, geography, culture, linguistics, and community to provide exact idea about existing market.

Neel Patel
Manager Business Development
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neel.patel@algororeports.com
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This release was published on openPR.