Diamond Wire Wafer Slicing Machine Market Getting High Traction due to Technological Innovations Till 2026

Worldwide Market Reports added Latest Research Report titled "Global Diamond Wire Wafer Slicing Machine Market by Manufacturers, Regions, Product Type and Application, Forecast to 2026" to its Large Report database.

Diamond wire wafer slicing machine is used for slicing silicon wafers that are used in photovoltaic cells. It has efficient slicing speed, good capacity, and provides favorable environmental protection when compared to the conventional mortar slicer.

Reduction in the cost of PV technology and increase in electricity price has increased the demand for photovoltaic and is in turn expected to drive growth of diamond wire wafer slicing machine market. Factors such as environmentally friendly attributes, minimum maintenance, and cost saving have also led to increasing demand for photovoltaic cells. This is further expected to boost growth of diamond wire wafer slicing machine market over the forecast period.

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Advantages offered by the diamond wire wafer slicing method, which includes clean and fast process, excellent cutting accuracy, low water and electricity consumption during production, and high return on investment is increasing the demand for this method, thereby propelling growth of the market.

Moreover, increasing incentives provided by many governments for the development of photovoltaic is another factor driving growth of diamond wire wafer slicing machine. However, photovoltaic panels require inverters and storage batteries, and will increase the investment cost for PV panels, which is expected to hamper growth of the global diamond wire wafer slicing machine market over the forecast period.

Key Developments in Diamond Wire Wafer Slicing Machine Market

Key players are adopting various strategies such as mergers, acquisitions, new product launches, expansions, collaborations, partnerships, approvals, and joint ventures to retain its position in the diamond wire wafer slicing machine market. On March 31, 2014, Dalian CNC machine co., LTD announced that its new product QPJ1660B kong line slicer won two strategic customer orders, which are contracts worth more than one hundred million yuan.

SlicingTech provides DW 288 diamond wire slicing system, which produces the lowest cycle times, best surface finishes, and lowest possible diamond wire consumption. It is of 200mm diameter capability and has fast wire acceleration and state of the art coolant spray nozzle technology.

On May 28, 2018, Meyer Burger’s Smartwire Connection technology was selected by Panasonic Solar for evaluation in the manufacture of its innovative high efficiency solar modules.

Some of the major players operating in the global diamond wire wafer slicing machine market include Dalian CNC machine Co., Ltd, OSAKA FUJI Corporation, Meyer Burger, Takatori, and SlicingTech among others.

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