Silicon Carbide Ingot Slicing Machine Market Share Driven by Diamond and Laser Slicing Technologies | Valuates Reports

Silicon Carbide Ingot Slicing Machine Market Size
The global market for Silicon Carbide Ingot Slicing Machine was valued at US$ 61.4 million in the year 2024 and is projected to reach a revised size of US$ 136 million by 2031, growing at a CAGR of 12.2% during the forecast period.

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The Silicon Carbide Ingot Slicing Machine Market is witnessing robust growth as demand for high-quality SiC wafers rises in the semiconductor and power electronics sectors. Increasing adoption of electric vehicles, renewable energy applications, and high-performance devices is driving the need for precise slicing technologies. Advancements in diamond and laser slicing methods, coupled with automation and efficiency improvements, are major market trends influencing market size and contributing to sustained market growth.

By Type
The Diamond Slicing segment currently holds the largest market share, valued for its precision, minimal kerf loss, and superior surface finish, making it ideal for high-performance SiC wafers. The Laser Slicing segment is experiencing rapid growth due to its potential for faster throughput, reduced mechanical stress, and suitability for next-generation wafer applications. Both slicing types are integral to modern semiconductor manufacturing processes.

By Application
The 4 Inch segment dominates the market, reflecting widespread adoption in standard SiC wafer production. The 6 Inch segment is growing rapidly as manufacturers shift to larger wafer sizes for improved efficiency and yield. The 8 Inch segment represents an emerging opportunity, particularly in high-power electronics and automotive semiconductor applications.

By Company
DISCO Corporation leads the market with the highest market share, offering advanced diamond slicing machines optimized for precision and yield. Suzhou Delphi Laser Co and Gaoce Inc are among the fastest-growing companies, expanding through laser slicing innovations and enhanced service networks. Other notable players including Xi An Lasic Semiconductor Technology Co and Han's Laser Technology are strengthening their positions with technological advancements and regional market expansion.

Regional Insights
Asia-Pacific dominates the market, led by China, Japan, and South Korea, driven by extensive SiC wafer manufacturing and strong electronics demand. North America and Europe remain significant due to advanced semiconductor facilities and high-quality production standards. Emerging regions such as Southeast Asia and Latin America are witnessing growing adoption as the demand for SiC-based high-performance devices expands.

The Silicon Carbide Ingot Slicing Machine Market is expected to maintain steady growth, supported by innovation in slicing technologies, increasing wafer size adoption, and expansion of electric and power electronics applications. Future market trends, market size, market share, and overall market growth will continue to be shaped by efficiency, precision, and technological advancement in slicing solutions.

by Type

• Diamond Slicing
• Laser Slicing

by Application

• 4 Inch
• 6 Inch
• 8 Inch

By Company

DISCO Corporation, Suzhou Delphi Laser Co, Gaoce Inc, Xi An Lasic Semiconductor Technology Co, Han's Laser Technology

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