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Ceramic IC Packages Market - by Application, Deployment Mode, Industry Vertical - Opportunity Analysis and Industry Forecast, 2016-2024

06-18-2018 12:35 PM CET | Business, Economy, Finances, Banking & Insurance

Press release from: Transparency Market Research

/ PR Agency: Transparency Market Research
Integrated circuit packaging is a last process of semiconductor device manufacturing. In this process, a small portion of the material used to make the semiconductor device is wrapped in a supplementary case. This is mainly done for avoiding physical damage as well as corrosion activities that might negatively affect the semiconductor device.

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Integrated circuit packaging is final stage of the semiconductor device fabrication, in which a tiny block of the semiconductor material is encapsulated in the supporting case that is used to prevent any physical damage or corrosion. The case which is called as "package" is used to support the electrical contact which connects the device to the circuit board.

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Ceramic IC packages are the package that mainly use ceramic materials. A wide variety of IC package types use ceramic materials. One of the main properties of ceramic IC packages is that they can be sealed hermetically and even with large number of electrical connections they can be manufactured in small sizes.

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The major driver for the ceramic IC packages market is the simple and easy manufacturing as compared to the plastic IC packages. Another major driver for the ceramic IC packages market is the increasing demand to meet the stringent requirements for reliability.

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