Flip Chip Technology Market 2018 by Global Leaders: UMC, ASE, Amkor Technology, STATS ChipPAC, Powertech Technology, STMicroelectronics, Texas Instruments, Intel

Market Research Future published a research report on “Flip Chip Technology Market Report- Forecast till 2023” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.

Market Highlights:

Flip-chip refers to semiconductors that are mounted with the active side down. Flip chip assembly offers many advantages. A key advantage is improved electrical performance. The small bumps of flip chip interconnection provide short electrical paths, which yield excellent electrical properties with low capacitance, inductance, and resistance. This results in greatly improved high-frequency performance compared to other interconnection methods such as chip-and-wire. Another important advantage of flip-chip assembly is its compactness. The electrical connection pads on the chip and substrate surfaces can be laid out as an area array, rather than around the periphery of the chip. This 2D-array structure can save chip space and reduce the footprint of the chip on the substrate.

Flip chip assembly has gained acceptance in a wide range of low-end and high-end electronic products. Miniaturization, enhanced the electrical performance, and high interconnection density are driving the applications of this technology. Many wireless device suppliers are expanding their use of flip chip technology to high-end ICs. For instance, 75% of new ASIC designs are now in the flip chip format, and this percentage is increasing.

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Existing 2-D integrated circuit (2.0DIC) flip-chip and wafer-level packaging technologies have shown solid growth over the past five years and are used in a number of mainstream applications predominantly in high-end smartphones. Flip chip packaging involves applying soldered bumps on the top side of a fabricated wafer, the integrated circuit can then be flipped and aligned with grooves on an external circuit to enable the necessary connections. This form of packaging occupies less space in products and offers higher input/ output rates because the whole surface area of the chip can be used for interconnection.

Emerging 2.5D IC and 3.0D IC technologies promise to extend flip-chip and wafer-level capabilities, enabling multiple dies to be stacked vertically together through the use of interposers and through silicon via (TSV) technology. The TSV stacking technology allows a greater amount of functionality to be packed into the chip without having to increase its size, and the interposer layer serves to shorten the critical electrical paths through the integrated circuit, creating faster input, and output.

Industry News

AUSTIN, Texas: The latest update for the industry is the news that flip chip technology is going to be launched in the commercial IC market. Earlier, this device was only utilized in high-end industries but now a company named LSI Corp’s has launched a series of four-layer laminate flip-chip packages that can be employed for networking and wireless-basestation markets.

Key Players

Some of the major players in Flip Chip Technology market are Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) among others.

Segmental Analysis

The worldwide flip chip technology market has been segmented into five distinct parts and they are listed as below:

• Packaging Technology: 3D, 2.5D and 2D packaging technology.
• Wafer Bumping Process: Tin-lead eutectic solder, copper(CU) pillar, gold stud plated solder and lead-free.
• Packaging Type: FC BGA, FC LGA, FC QFN, FC CSP, FC PGA and FC SIP.
• Applications: Automotive, telecommunications, consumer electronics, military & aerospace, industrial and medical devices.
• Products: LED, CMOS image sensor, mixed signal, CPU, analog, RF, SoC and power IC.

Regional Insights

The global market for flip chip technology has been successful in establishing itself across the globe. Some of the major regions include North America, Europe, Asia Pacific and Rest of the World.

Region-wise the area that has the upper hand is Asia Pacific. It is anticipated to stay in the lead and develop throughout the forecast period at an encouraging CAGR. The countries like China and India have a vast scope for development as they are the prime manufacturing centers. It is believed that these regions will open doors to many new and exciting opportunities for the market.

After Asia Pacific, North America is second in command, it grabs largest market share after APAC. This fact can be attributed to the presence of major market players in this area and the high expenditure on R&D activities.

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Intended Audience

• Wafer manufacturers
• Raw material and manufacturing equipment suppliers
• Chip manufacturers
• System integrators
• Device manufacturers
• Foundry players
• Distributors and retailers
• Research organizations

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This release was published on openPR.