Packaged IC Component Inspector Market - Emerging Niche Segments and Regional Markets

Integrated circuits are placed into protective packages in order to allow efficient assembly and handling onto PCBs (printed circuit boards) and to protect the electronic devices from damage. Different sort of packaging techniques are present. Packaged IC component inspector systems primarily increase the throughput and boost the package changeover than traditional methods. The market has been segmented into by IC packaged inspection type surface mounting, through-hole mounting, pin grid array, ball grid array, flip chip inspection, plastic encapsulated IC inspection, flat package, molded underfill inspection among others.

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Moreover, the market has been also segmented by end use industry which includes consumer electronics, industrial equipment, aerospace and military, automotive, telecommunication, healthcare among others. The market for packaged IC component inspector by region has been segmented into, Europe, Asia Pacific, North America, MEA (Middle East and Africa) and South America.

Integrated circuit packages are made of different sort of materials for instance plastic of a molded package, silicon circuit contained within the package and ceramic package. Each package material carries different mechanical characteristics, for example elastic modulus and thermal expansion, primarily which cater to development of mechanical stresses when the whole package is subjected to thermal excursions. Circuits are exponentially smaller in size and defects have become smaller and much more difficult to identify or detect.

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Detecting defects is a crucial process in order to prevent mechanical, electrical and thermal failures. To ensure no defects reach the end users, packaged semiconductor producers are looking for advanced analytic capabilities along with finer-resolution imaging to fine-tune their processes and designs. In addition, increasing customer demand for higher throughput to enable 100% semiconductor inspection at production speeds is also fueling the market for packaged IC component inspector. Some of the defects which are inspected by the packaged IC component inspector include number of the cracks in the IC die, delamination of one package interface from another and cracks in the body of the package.

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Some of the major inspection system application includes flip chip inspection, stacked die imaging, multi-chip and hybrid module inspection and ball grid arrays among others. Increasing technological advancement in the field of semiconductor component manufacturing is one of the prime reasons behind the growth of packaged IC inspection globally. Major semiconductor component manufacturer are focusing on innovating improved semiconductor inspection technology to meet the complex packaging challenges. Improved performance, fault less semiconductor components, higher throughput are some of the prime characterization of packaged IC component inspector, which in turn is fueling the application in different end use industries. Cyclical nature of semiconductor industry may be considered as one of the restraining factor which may inhibit the growth of the packaged IC component inspector market. However, application of packaged IC component inspector for nanoelectronics industry is one of the prime opportunities for the market.

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