Integrated Passive Devices Market 2018 Trending Key Players: Infineon Technologies, Texas Instruments, STMicroelectronics, Micron Technology, STATS ChipPAC, Global Communication Semiconductors, Global Communication Semiconductors

Market Highlights:

Integrated Passive Device or IPD's is a growing technology which offers ideal trade-off for system in package integration. Passive devices are essential parts of System–in-Package (SiP) solutions and today, it is getting used in various functions in semiconductor industry including- s decoupling, biasing, resonating, filtering, matching and transforming among others. As, the new technologies are coming into picture and demand for the small, lightweight products are increasing, it is also driving the market of integrated passive devices. Integration of passive devices on the silicon wafers, companies are achieving new levels and becoming capable of producing IPDs which are significantly smaller, thinner and higher performance than the standard discrete passive devices. According to a recent study report published by the Market Research Future, The global market of Integrated Passive Devices Market is booming and expected to gain prominence over the forecast period. The market is projected to demonstrate a spectacular growth by 2022, surpassing its previous growth records in terms of value with a striking CAGR during the anticipated period (2016 – 2022).

The aspects such as growing adoption of integrated passive devices in consumer electronics and the implementation of integrated passive devices in RF applications are the major driving factors for this market. However, factors such as high cost of integrated passive devices compared to discrete components are hampering the market growth. Further, the RF tuning of integrated passive devices demands longer product design cycle, which acts as a major restraining factor for the market.

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Key Players

On Semiconductor (U.S.), Infineon Technologies AG (Germany), Texas Instruments Inc. (U.S.), STMicroelectronics (U.S.), Micron Technology, Inc. (U.S.), STATS ChipPAC Ltd (Singapore), Global Communication Semiconductors, Inc. (U.S.), Global Communication Semiconductors, LLC (U.S.), 3DiS Technologies (France), OnChip Devices, Inc. (U.S.), Johanson Technology, Inc. (U.S.) are some of the prominent players at the forefront of competition in the Global Integrated Passive Devices Market and are profiled in MRFR Analysis.

Industry News

May 11, 2016 - STATS ChipPAC Pte. Ltd., a leading provider of advanced semiconductor packaging and test services, announced that it has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB). FOWLP or eWLB is an advanced packaging technology platform that provides ultra-high density interconnection, superior electrical performance and the ability to integrate multiple heterogeneous dies in a cost effective, low-profile semiconductor package.
January 19, 2018- As the preferred solution for semiconductor reference designs, Johnson Technology has joined Sigfox’s preferred partner network as an antenna and RF-front end solutions provider. Theirs embedded ceramic antenna and design services for small-cell IoT environment makes it a great fit for this cooperative effort.

Competitive Analysis

The market of Integrated Passive Devices market appears to be highly competitive. To maintain their market position and to drive the market growth, various dynamic and diversified international organizations, domestic organizations and as well as new entrants form a competitive landscape. Market leaders are innovating continuously and increasingly seeking market expansion through various strategic mergers and acquisitions, innovation, increasing investments in research and development and cost-effective product portfolio. Major players are investing on internal R&D and, most of all, in acquiring other firms.

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Integrated Passive Devices Market Global Market - Segmentation
The Integrated Passive Devices Market can be classified into 5 key segments for the convenience of the report and enhanced understanding;
Segmentation by Base: Comprises silicon and non-silicon.
Segmentation by Product: Comprises Baluns and Couplers, Harmonic Filters, Diplexers, others (Triplexers, ESD Diodes, and Customized IPDs).
Segmentation by Type: Comprises ESD, EMI, RF-IPD and Others (LEDs.
Segmentation by Application: Comprises EMI/RFI Filtering, LED Lighting Data Converters
Segmentation by Regions: Comprises Geographical regions - North America, Europe, APAC and Rest of the World.

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This release was published on openPR.