Solder Ball 2018 Global Market Key Players – Senju Metal, DS HiMetal, MKE, YCTC – Analysis and Forecast to 2022

WiseGuyRerports.com Presents “Global Solder Ball Market by Manufacturers, Countries, Type and Application, Forecast to 2022” New Document to its Studies Database

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

Scope of the Report: 
This report focuses on the Solder Ball in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers 
Senju Metal 
DS HiMetal 
MKE 
YCTC 
Nippon Micrometal 
Accurus 
PMTC 
Shanghai hiking solder material 
Shenmao Technology

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Market Segment by Regions, regional analysis covers 
North America (USA, Canada and Mexico) 
Europe (Germany, France, UK, Russia and Italy) 
Asia-Pacific (China, Japan, Korea, India and Southeast Asia) 
South America (Brazil, Argentina, Columbia etc.) 
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers 
Lead Solder Ball 
Lead Free Solder Ball

Market Segment by Applications, can be divided into 
BGA 
CSP & WLCSP 
Flip-Chip & Others

Table Of Contents:                                                                                                                          

1 Market Overview 
1.1 Solder Ball Introduction 
1.2 Market Analysis by Type 
1.2.1 Lead Solder Ball 
1.2.2 Lead Free Solder Ball 
1.3 Market Analysis by Applications 
1.3.1 BGA 
1.3.2 CSP & WLCSP 
1.3.3 Flip-Chip & Others 
1.4 Market Analysis by Regions 
1.4.1 North America (USA, Canada and Mexico) 
1.4.1.1 USA Market States and Outlook (2012-2022) 
1.4.1.2 Canada Market States and Outlook (2012-2022) 
1.4.1.3 Mexico Market States and Outlook (2012-2022) 
1.4.2 Europe (Germany, France, UK, Russia and Italy) 
1.4.2.1 Germany Market States and Outlook (2012-2022) 
1.4.2.2 France Market States and Outlook (2012-2022) 
1.4.2.3 UK Market States and Outlook (2012-2022) 
1.4.2.4 Russia Market States and Outlook (2012-2022) 
1.4.2.5 Italy Market States and Outlook (2012-2022) 
1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia) 
1.4.3.1 China Market States and Outlook (2012-2022) 
1.4.3.2 Japan Market States and Outlook (2012-2022) 
1.4.3.3 Korea Market States and Outlook (2012-2022) 
1.4.3.4 India Market States and Outlook (2012-2022) 
1.4.3.5 Southeast Asia Market States and Outlook (2012-2022) 
1.4.4 South America, Middle East and Africa 
1.4.4.1 Brazil Market States and Outlook (2012-2022) 
1.4.4.2 Egypt Market States and Outlook (2012-2022) 
1.4.4.3 Saudi Arabia Market States and Outlook (2012-2022) 
1.4.4.4 South Africa Market States and Outlook (2012-2022) 
1.4.4.5 Nigeria Market States and Outlook (2012-2022) 
1.5 Market Dynamics 
1.5.1 Market Opportunities 
1.5.2 Market Risk 
1.5.3 Market Driving Force 
2 Manufacturers Profiles 
2.1 Senju Metal 
2.1.1 Business Overview 
2.1.2 Solder Ball Type and Applications 
2.1.2.1 Type 1 
2.1.2.2 Type 2 
2.1.3 Senju Metal Solder Ball Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 
2.2 DS HiMetal 
2.2.1 Business Overview 
2.2.2 Solder Ball Type and Applications 
2.2.2.1 Type 1 
2.2.2.2 Type 2 
2.2.3 DS HiMetal Solder Ball Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 
2.3 MKE 
2.3.1 Business Overview 
2.3.2 Solder Ball Type and Applications 
2.3.2.1 Type 1 
2.3.2.2 Type 2 
2.3.3 MKE Solder Ball Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 
2.4 YCTC 
2.4.1 Business Overview 
2.4.2 Solder Ball Type and Applications 
2.4.2.1 Type 1 
2.4.2.2 Type 2 
2.4.3 YCTC Solder Ball Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 
2.5 Nippon Micrometal 
2.5.1 Business Overview 
2.5.2 Solder Ball Type and Applications 
2.5.2.1 Type 1 
2.5.2.2 Type 2 
2.5.3 Nippon Micrometal Solder Ball Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 

Continued…….

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