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3D wire bonded, in technology segment accounted for the highest demand in the 3D semiconductor packaging market

03-16-2018 07:45 AM CET | Business, Economy, Finances, Banking & Insurance

Press release from: Variant Market Research

Variant Market Research

Variant Market Research

SAN FRANCISCO, Mar. 16, 2018 According to the latest report published by Variant Market Research, the global 3D semiconductor packaging market size was valued at $4 billion in 2016 and it estimated to reach $12 billion by 2024. In this report, the global 3D semiconductor packaging market forecast says that the global market is growing at a CAGR of 15.2% from 2016 to 2024.

Click Here to Request a Free Sample PDF of This Report @ https://www.variantmarketresearch.com/report-categories/semiconductor-electronics/3d-semiconductor-packaging-market/sample-request

3D semiconductor packaging market is majorly driven by advanced packaging technologies & advancement over 2D packaging.
The global 3D semiconductor packaging market trend include increase in number of compact electronic devices and short replacement time of electronic products are the major driver boosting the. In addition, advancement over 2D packaging technologies are also supporting the market growth. Though, high initial capital investment is the major hindrance for the market growth. Moreover, rising development of internet of things are the opportunities for the market in near future.

Market Segmentation

Technology, material type, industry vertical and geography are the major segmentation considered in the global 3d semiconductor packaging market. Technology Type, the segment is bifurcated into 3D package-on-package, 3D fan-out based, 3D fan-out based, 3D wire-bonded, 3D through-silicon-via, and other technologies. Material type segment is bifurcated into die attach material, bonding wire, encapsulation resin, organic substrate, lead frame, ceramic package, and other materials. Further, by industries verticals the segment is classified into IT & telecommunication, automotive & transport, aerospace & defense, industrial, electronics, healthcare, and others.
By geography, the global 3D semiconductor packaging market has been bifurcated into Europe, North America, Asia-Pacific and Rest of the World (RoW). North America is further bifurcated in U.S., Canada, and Mexico whereas Europe covers Italy, France, Germany, UK, and Rest of Europe. Asia-Pacific is categorized into Japan, South Korea, China, India, and Rest of Asia-Pacific, while Rest of the World is bifurcated into Middle East, South America, and Africa.

3D wire bonded, in technology segment accounted for the highest demand in the 3D semiconductor packaging market

3D wire bonded held for the highest demand in the 3D semiconductor packaging market technology segment owing to its high market penetration and already widespread usage. Flash memory is also used on a vast scale in consumer electronics and robotics, additional boosting the demand for 3D wire bonded.

In material type segments, bonding wire accounted for the largest market share in 2016

In the year 2016, bonding wire accounted for the maximum 3D semiconductor packaging market share in 3d semiconductor packaging market due to bonding wire utilized in 3D wire bonded packaging design.

Get Table of Content (TOC) @ https://www.variantmarketresearch.com/report-categories/semiconductor-electronics/3d-semiconductor-packaging-market/toc

In the year 2016, electronic accounted for around half of the total market share in industry vertical segment

Electronics is the industry vertical type segments accounted for around half of the total market share in 2016, due to increased adoption of 3D semiconductor packaging in portable electronic devices.

Asia-Pacific dominated the leading share in the global 3D semiconductor packaging market

In the year 2016, Asia-Pacific led for the highest market share the growth is mainly seen by increasing demand for these chips in China, Taiwan, and Japan. North America accounted for the second largest market share of 23.1%. In terms of growth, Asia-Pacific is expected to grow at the fastest CAGR of 16.2% during the forecast period 2016-2024.

Competitive Landscape

Major companies operating in the 3D semiconductor packaging market are ASE group, Ltd., Siliconware Precision Industries Co., Taiwan Semiconductor Manufacturing Company, Amkor Technology, SUSS MicroTec AG., Jiangsu Changjiang Electronics Technology Co. Ltd, STMicroelectronics IBM Corporation, Qualcomm Technologies, Inc., Intel Corporation, among others.

To browse the complete report, visit @ https://www.variantmarketresearch.com/report-categories/semiconductor-electronics/3d-semiconductor-packaging-market

Scope of 3D Semiconductor Packaging Market
Technology Type Segments
• 3D package-on-package
• 3D wire-bonded
• 3D fan-out based
• 3D through-silicon-via
• Others

Materials Type Segments
• Bonding wire
• Organic substrate
• Encapsulation resin
• Leadframe
• Ceramic package
• Die attach material
• Others

Industry Vertical Type Segments
• Industrial
• Electronics
• Healthcare
• IT & telecommunication
• Automotive & transport
• Aerospace & defense
• Others

Geographical Segments
• North America
o US
o Canada
o Mexico

• Europe
o U.K.
o Italy
o France
o Germany
o Others

• Asia-Pacific
o China
o India
o Japan
o South Korea
o Others

• RoW
o South America
o Middle East
o Africa

Related Topics
1. Global Photonics Integrated Circuit (IC) Market - https://www.variantmarketresearch.com/report-categories/semiconductor-electronics/photonics-ic-pic-market

2. Global Industrial Robotics Market - https://www.variantmarketresearch.com/report-categories/semiconductor-electronics/industrials-robotics-market

3. Global Magneto Resistive RAM (MRAM) Market - https://www.variantmarketresearch.com/report-categories/semiconductor-electronics/magneto-resistive-ram-market

4. Global Electric Motor Market - https://www.variantmarketresearch.com/report-categories/semiconductor-electronics/electric-motor-market

About Variant Market Research
Variant Market Research offers syndicated and customized reports to fulfill clients' objectives. We also provide customized data pack proposing market sizing in an Excel/PDF/PowerPoint or Word format as per the requirement of clients. We cover several industry domains, namely Semiconductor & Electronics, Consumer Electronics, Information and Communication Technology, Automotive, Consumer Goods, Food & Beverages, Pharmaceuticals, Medical Devices, Chemicals, Industrial, Mining Equipment, Automation, Manufacturing, Construction, Energy &Power, Defense & Aerospace and Banking, Financial services and Insurance (BFSI). Our expertise are data triangulation, competitor benchmarking, parent market benchmarking, estimating market size and forecast of the market from 2016 to 2024.
For further information, visit https://www.variantmarketresearch.com
You can connect with us on LinkedIn here @ https://www.linkedin.com/company/variant- market-research

Contact US:
John Dave,
Head - Sales
Variant Market Research
649 Mission St, 5th Floor, San Francisco, CA 94105, United States.
Tel: +1-415-680-2785
Fax: +1-415-680-2786
Email: john.dave@variantmarketresearch.com
Email: help@variantmarketresearch.com

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