Liquid Encapsulation Equipment Market: Growing technological innovation in the electronics sector is driving the demand

The wide range of devices such as electronic circuit boards and various such devices mostly contain discrete resistors, semiconductors, glass diodes, capacitors, silica chips and gold wire transistors. Any damage to these components may lead to the malfunctioning of the device. Thus with the adoption of liquid encapsulation process helps in providing protection to these delicate electronic components against mechanical and thermal shocks or impacts and further helps in protection from corrosive chemicals and moisture.

The liquid encapsulation also provides protection to various technologies which are integrated inside a device. This process is one of the most advanced packaging technologies for almost every semiconductor devices as it offers low warpage, low stress and high thermal conductivity. The liquid encapsulation is widely applied in products with discrete sensors, integrated circuits and optoelectronics. The liquid encapsulation method is more widely used after the advent of the automated dispensing equipment.

Some of the key factors driving the liquid encapsulation equipment market include rising demand for various advanced packaging techniques, growth in demand for consumer electronics. Growing technological innovation in the electronics sector is further expected to drive the demand for liquid encapsulation equipment market. Further growing trend towards miniaturization of electronic devices is expected to drive the demand for liquid encapsulation. Low rate of penetration of the liquid encapsulation in developed regions like Europe and North America is a key restrain for the liquid encapsulation market growth.

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The liquid encapsulation equipment market by product segment has been segmented into optoelectronics, integrated circuits, sensors and discrete semiconductors. The liquid encapsulation equipment market by material has been segmented into epoxy modified resins, epoxy resins and other materials.

The liquid encapsulation equipment market by end use industry has been segmented into automotive, telecommunications, electronics and other industrial applications. The electronic segment in the liquid encapsulation equipment market segmented by end use industry is expected to lead the segment over the next few years. This demand for the liquid encapsulation equipment is attributed to the wide spread applications and high penetration in the electronics sector. Further, growing application of liquid encapsulation equipment in the automotive industry is a key opportunity for the market growth over the near future.

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Geographically the global liquid encapsulation equipment market has been broadly segmented into North America, Latin America, Middle East and Africa, Asia Pacific and Europe. Asia Pacific lead the global liquid encapsulation equipment market sand also expected to grow at the fastest rate over the next few years. Rise in demand for wireless technology, sensors and optoelectronics are some of the factors fueling the demand for liquid encapsulation equipment in Asia Pacific.

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North America and Europe has very low penetration for the liquid encapsulation equipment, though with the enhancement of the liquid encapsulation equipments with more focus in research and development by the leading players operating in the market is expected to drive the market in the near future.

The key players operating in the global liquid encapsulation equipment market include Sumitomo Bakelite Co., Ltd (Japan), Shin – Etsu Chemical Co. Ltd., Henkel AG and Co. KGaA (Germany), Hitachi Chemical Co. Ltd (Japan), Nitto Denko Corporation (Japan), Nagase & Co., Ltd (Japan), Kyocera Corporation (Japan), Panasonic Corporation (Japan), Nitto Denko Corporation (Japan), Resin Technical Systems (U.K.), BASF Se (Germany), Epic Resins (U.S.), Sanyu Rec Co. Ltd. (Japan) among others.

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