E-Scrap - Charging up electronics recycling sustainably !! Business Opportunities in the Electronics Recycling Sector

The global e-scrap and printed circuit board (PCB) e-scrap market features a fragmented as well as diversified landscape, notes analysts at Transparency Market Research (TMR).Top players operating in the e-scrap and PCB e-scrap market include LS-Nikko Copper Inc., Umicore N.V., Ultromext Ltd., Dowa Holdings Co. Ltd., and Boliden Group. Several leading players are focusing on consolidating their scrapping facilities to consolidate their shares over the forecast period. A number of prominent players are also inclined to provide streamlined e-waste management and disposal, with an aim to support sustainable resource management in various economies.

The global printed circuit board e-scrap market stood at 1.46 million tons in 2015 and is projected to clock a CAGR of 7.3% from 2016 to 2026. Rising at the pace, the market is estimated to touch a valuation of 3.14 million tons by the end of 2026. The global e-scrap market stood at US$55.34 bn in 2015 and is prognosticated to rise at 5.6%, vis-à-vis volume, during the same period.

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The various sources of e-scrap and printed circuit board (PCB) e-scrap comprise household appliances, IT and telecommunication products, and entertainment devices. Of these, household appliances account for the dominant source of e-scrap in 2015 and the segment is projected to rise at a substantial pace over the forecast timeline. The growth is fueled by the rapid rate of disposal of electronics items across households. Regionally, Asia Pacific is the most attractive regional market for e-scrap and PCB e-scrap. The opportunities in the regional market is projected to reach US$33.5 bn by 2026 end. Countries at the forefront of the growth are China, Japan, Australia, South Korea, and India, with China expected to present abundant lucrative avenues.

Household Disposal of Electronic Goods Contribute to Growth

The e-scrap and PCB e-scrap market is primarily driven by the rising demand for technologies and systems to recycle e-waste in various parts of the world. The staggering uptake of electronic products in various economies and the consequent rapid disposable of these products owing to the rise in disposal incomes are key factors boosting the market. The consistent pace of urbanization in a number of developing economies is a notable factor aiding in the expansion of the e-scrap and PCB e-scrap market. To meet a burgeoning demand for e-waste recycling, scrap recycling capacities are witnessing a substantial expansion in various developing and developed regions.

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The rising demand for recovering precious metals from electronic waste in various economies is accentuating the demand for e-scrap recycling facilities. In particular, the sustained focus on optimizing the recovery of precious metals as a vital part of sound resource management practices in various countries has intensified the need for better recycling of e-waste. This is significantly benefitting the mining industry.

The e-scrap and PCB e-scrap market is also witnessing a robust impetus driven by the role played by recycling of e-waste in the conservation of energy and the efforts to reduce greenhouse gas emissions in low-carbon economy.

Rapid Pace of Urbanization Bolster Demand for E-scrap and PCB E-scrap Recycling

The substantially rising use of copper and other metals in the sectors such as construction and telecommunication has bolstered the need for recycling e-scrap and PCB e-scrap recycling. The vast rise in installation of electric grid in several industrialized nations, notably in key economies of Asia Pacific, is contributing to the demand for e-scrap recycling systems.

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However, the lack of awareness of the health and environment hazards posed by e-scrap and the inadequate focus on recycling e-waste in less developed communities are crucial factors hindering the growth of the market. Nevertheless, the rise in industry efforts to properly recycle unprocessed waste will create abundant opportunities for market players to tap.

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This release was published on openPR.