Advanced Packaging Market Outlook to 2017 – ASE, SPIL, Amkor Technology, Chipmos Technologies, Chipbond Technology, and other Players

In 2016, the world economy expanded by just 2.2 per cent, the slowest rate of growth since the Great Recession of 2009. Underpinning the sluggish global economy are the feeble pace of global investment, dwindling world trade growth, flagging productivity growth and high levels of debt. World gross product is forecast to expand by 2.7 per cent in 2017 and 2.9 per cent in 2018, with this modest recovery more an indication of economic stabilization than a signal of a robust and sustained revival of global demand. Given the close linkages between demand, investment, trade and productivity, the extended episode of weak global growth may prove self-perpetuating in the absence of concerted policy efforts to revive investment and foster a recovery in productivity. This would impede progress towards the Sustainable Development Goals (SDGs), particularly the goals of eradicating extreme poverty and creating decent work for all.

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For the sake of making you deeply understand the Advanced Packaging industry and meeting you needs to the report contents, North America Advanced Packaging Industry Situation and Prospects Research report will stands on the report reader's perspective to provide you a deeply analysis report with the integrity of logic and the comprehensiveness of contents. We promise that we will provide to the report reader a professional and in-depth industry analysis no matter you are the industry insider,potential entrant or investor.

Firstly, the report provides a basic overview of the industry including definitions, classifications, applications and industry chain structure. The Advanced Packaging market analysis is provided for the international market including development history, competitive landscape analysis, and major regions' development status.

Complete Report is Available at: http://www.reportsweb.com/north-america-advanced-packaging-industry-situation-and-prospects-research-report

Split by Product Types, with production, revenue, price, and market share and growth rate of each type, can be divided into

Active Technology

Intelligent Technology

Modified Atmosphere

Split by applications, this report focuses on consumption, market share and growth rate of Advanced Packaging in each application, can be divided into

Automotive Electronics

Consumer Electronics

Communication

Other

Secondly, development policies and plans are discussed as well as manufacturing processes and cost structures. This report also states import/export, supply and consumption figures as well as cost, price, revenue and gross margin by regions (Canada, U.S.A, and Others), and other regions can be added.

Then, the report focuses on global major leading industry players with information such as company profiles, product picture and specification, capacity, production, price, cost, revenue and contact information. Upstream raw materials, equipment and downstream consumers analysis is also carried out. What's more, the Advanced Packaging industry development trends and marketing channels are analyzed.

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This report Advanced Packaging in North America market, especially in United States, Canada and Mexico focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering

Market Research Key Players List:

ASE

SPIL

Amkor Technology

Stats Chippac

Powertech Technology

Jiangsu Changjiang Electronics Technology

J-Devices

UTAC

Chipmos Technologies

Chipbond Technology

STS Semiconductor

Tianshui Huatian Technology

Nantong Fujitsu Microelectronics

Carsem Semiconductor

Walton Advanced Engineering

Unisem

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