Electrodeposited Copper Foils Market to Touch US$ 16,005.6 Mn by 2025
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Global Electrodeposited Copper Foils Market: Segmentation and Forecast
The global electrodeposited copper foils market is segmented on the basis of thickness (50 μm) and on the basis of application (Printed Circuit Boards, EMI Shielding, Batteries, Switchgear, others).
By thickness, it is estimated that 50 μm segment is estimated to be valued at US$ 689.9 Mn in the year 2017 and is poised to reach a value of US$ 1,073.8 Mn in the year 2025, exhibiting a CAGR of 5.7% during the forecast period.
By application, the printed circuit boards segment is estimated to be valued at US$ 4,754.6 Mn in the year 2017 and is expected to reach a value of US$ 11,420.9 Mn in the year 2025, displaying a CAGR of 11.6% during the assessment period.
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By application, EMI shielding segment is estimated to be valued at US$ 83.6 Mn in the year 2017 and is slated to reach a value of US$ 132.2 Mn in the year 2025, exhibiting a CAGR of 5.9% during the assessment period.
Global Electrodeposited Copper Foils Market: Regional Forecast
Persistence Market Research tracks the performance of the global electrodeposited copper foils market across the key geographies of North America, Latin America, Europe, Asia Pacific and MEA. As per the forecast, Asia Pacific electrodeposited copper foils market is estimated to be valued at US$ 5,889.4 Mn in the year 2017 and is slated to reach a value of US$ 14,715.9 Mn in the year 2025, exhibiting a CAGR of 12.1% during the period of assessment. Thus, the Asia Pacific region is completely dominating the global electrodeposited copper foils market. North America electrodeposited copper foils market is estimated to be valued at US$ 431.2 Mn in the year 2017, and is poised to reach a value of US$ 741.3 Mn in the year 2025, displaying a CAGR of 7% during the forecast period.
Global Electrodeposited Copper Foils Market: Vendor Insights
The report profiles some of the leading players operating in the global electrodeposited copper foils market such as Mitsui Mining & Smelting Co., Ltd, JX Nippon Mining & Metals Corporation, Jiangxi Copper Corporation, Furukawa Electric Co., Ltd., Nan Ya Plastics Corp., Arcotech Ltd., Kingboard Copper Foil Holdings Ltd, Guangdong Chaohua Technology Co., Ltd., LS MTRON LTD and Chang Chun Petrochemical Co., Ltd. among others. The major suppliers of electrodeposited copper foils are channelizing efforts towards developing partnerships with end users, such as PCB and Battery manufacturers, in order to better address the demand and cater to exacting standards and specific requirements.
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