Press release
Liquid Encapsulation Market Technological breakthroughs By 2025
Electronic circuit boards and other devices typically contain discrete semiconductors, resistors, capacitors, glass diodes, gold wire transistors, and silica chips, damage to which may result in failure of vital device functions. The process of liquid encapsulation plays a vital role in protecting delicate electronic components against thermal or mechanical shock, moisture, and chemicals.They also maintain the security of the technology. The liquid encapsulation technique is also widely used in products such as discrete integrated circuits, sensors, and optoelectronics.
With the advent of automated dispensing equipment, liquid encapsulation has become the most sought after method among manufacturers since the past few years. The liquid encapsulation market is currently growing at a nascent stage but is expected to gain momentum, witnessing strong growth over the forecast period, 2015-2025. FMI’s research indicates ample of growth opportunities for the global market throughout the 10-year period.
Global Liquid Encapsulation Market: Key Drivers
Increasing technological innovation in the electronics industry is anticipated to drive the demand for protective encapsulation. Moreover, the advancement of potting and encapsulation technologies is projected to offer several growth opportunities to the market globally. Growing demand for high-end packaging techniques, and rising number of electronic products miniaturisation practices are also the key drivers responsible for the growth of market.
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Other drivers identified to fuel the market growth include elevated expansion of consumer electronics market and growing advancements in sensors and integrated circuits market. The market is also expected to gain traction due to growing number of dispense equipment industries, and sealant and meter/mix manufacturers.
Growth Restraint
Although the applications of encapsulation in electronics and automotive industries are foreseen to increase in the near future, FMI’s research observes sluggish demand for liquid encapsulates in developed markets, including N. America and Europe. This demand pattern may restrain the consumption of liquid encapsulation materials in the market.
Liquid Encapsulation Market: Segmentation
FMI’s research report on the global liquid encapsulation market offers a 10-year forecast, segmenting the market on the basis of encapsulating material, encapsulated product, and application.
Based on the encapsulating material, the global liquid encapsulation market is segmented into epoxy resin, epoxy-modified resin, and others. Epoxy resins are predicted to gain a sprint in sales in the near future, owing to their application in electronics.
According to the encapsulated product, the market is segmented into integrated circuits, sensors, discrete semiconductors, and optoelectronics. Integrated circuits are estimated to cover the highest share of the total liquid encapsulation market revenues.
On the basis of application, the global liquid encapsulation market is segmented into electronics, automotive, industrial, and telecommunications. Among all the applications, the electronic applications segment currently leads the market and is expected to continue its domination globally over the forecast period.
Regional Outlook: Global Liquid Encapsulation Market
The global liquid encapsulation market is segmented on the basis of region, into North America, Latin America, Western Europe, Asia-Pacific excluding Japan (APEJ), Eastern Europe, Japan, and Middle East and Africa (MEA).
Over the forecast period 2015-2025, the Asia Pacific region is expected to dominate the market, witnessing the fastest growth rate. Being an emerging hub for the manufacturing of electronics and telecommunications products, the regions such as South Korea, China, and Taiwan are anticipated to provide an impetus to market growth.
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Moreover, increasing acceptance of wireless technologies, and growing demand for encapsulation materials from sensor devices and optoelectronics are identified to fuel the demand for liquid encapsulation materials in the Asia Pacific market.
Key Players in the Global Liquid Encapsulation Market
Some of the companies leading the global liquid encapsulation materials market include Henkel AG & Company KGaA, Panasonic Corporation, BASF SE, Sumitomo Bakelite Co. Ltd., Hitachi Chemical Co. Ltd., Sanyu Rec Co. Ltd., Resin Technical Systems, Shin-Etsu Chemical Co. Ltd., Kyocera Corporation, Nagase & Co. Ltd, Nitto Denko Corporation, and Epic Resins.
While BASF SE is the undisputed chemical giant of the German market, experts predict multiple mergers and acquisitions related to the company in the near future. Similarly, Henkel AG & Company KGaA is also anticipated to consider acquisitions for better growth opportunities.
About FMI
Future Market Insights is the premier provider of market intelligence and consulting services, serving clients in over 150 countries. FMI is headquartered in London, the global financial capital, and has delivery centres in the U.S. and India.
FMI’s research and consulting services help businesses around the globe navigate the challenges in a rapidly evolving marketplace with confidence and clarity. Our customised and syndicated market research reports deliver actionable insights that drive sustainable growth. We continuously track emerging trends and events in a broad range of end industries to ensure our clients prepare for the evolving needs of their consumers.
FMI’s team of over 200 research analysts provides market intelligence at global, regional, and country level. Our analysts are committed to provide independent insights, relying on our cognitive defusion training module, which conditions them to look at data objectively and unbiasedly.
Future Market Insights
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